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产品型号XC2V3000-4FG676I的概述

芯片XC2V3000-4FG676I的概述 XC2V3000-4FG676I是一款由赛灵思（Xilinx）公司设计并制造的可编程逻辑器件，属于其Virtex系列产品中的一种。该芯片以其高性能、灵活性和较好的集成度而广泛应用于各种数字电路设计中。XC2V3000采用基于32位RISC架构的硬件，可以有效支持复杂的算法处理和高速数据传输。该器件特别适合于需要高计算能力和大量并行处理的应用场合，如通信、图像处理和工业控制等领域。本芯片配置有丰富的逻辑单元、嵌入式存储器以及高速I/O接口，能够满足不同类型应用的需求。XC2V3000-4FG676I不仅提供了可编程的逻辑功能，还允许用户根据具体应用的需求进行灵活的电路设计，从而提升了设计的效率和灵活性。芯片XC2V3000-4FG676I的详细参数 - 逻辑单元（Logic Cells）：该芯片拥有超过3000个可编程逻辑单元，便于用户进行...

产品型号XC2V3000-4FG676I的Datasheet PDF文件预览

Virtex-II 1.5V

Field-Programmable Gate Arrays

DS031-1 (v1.7) October 2, 2001

Advance Product Specification

Summary of Virtex -II Features

•

Industry First Platform FPGA Solution

Digitally Controlled Impedance (DCI) I/O: on-chip

termination resistors for single-ended I/O standards

•

IP-Immersion™ Architecture

PCI-X @ 133 MHz, PCI @ 66 MHz and 33 MHz

compliance, and CardBus compliant

Densities from 40K to 8M system gates

420 MHz internal clock speed (Advance Data)

840+ Mb/s I/O (Advance Data)

Differential Signaling

840 Mb/s Low-Voltage Differential Signaling I/O

(LVDS) with current mode drivers

Bus LVDS I/O

Lightning Data Transport (LDT) I/O with current

driver buffers

•

SelectRAM™ Memory Hierarchy

3 Mb of True Dual-Port™ RAM in 18-Kbit block

SelectRAM resources

Up to 1.5 Mb of distributed SelectRAM resources

High-performance interfaces to external memory

Low-Voltage Positive Emitter-Coupled Logic

(LVPECL) I/O

DDR-SDRAM interface

FCRAM interface

QDR™-SRAM interface

Sigma RAM interface

Built-in DDR Input and Output registers

Proprietary high-performance SelectLink™

Technology

High-bandwidth data path

Double Data Rate (DDR) link

Web-based HDL generation methodology

•

Arithmetic Functions

Dedicated 18-bit x 18-bit multiplier blocks

Fast look-ahead carry logic chains

•

Supported by Xilinx Foundation™ and Alliance™

Series Development Systems

Flexible Logic Resources

Up to 93,184 internal registers / latches with Clock

Integrated VHDL and Verilog design flows

Compilation of 10M system gates designs

Internet Team Design (ITD) tool

Enable

Up to 93,184 look-up tables (LUTs) or cascadable

16-bit shift registers

SRAM-Based In-System Configuration

Wide multiplexers and wide-input function support

Fast SelectMAP™ configuration

Horizontal cascade chain and Sum-of-Products

support

Triple Data Encryption Standard (DES) security

option (Bitstream Encryption)

Internal 3-state bussing

IEEE1532 support

•

High-Performance Clock Management Circuitry

Partial reconfiguration

Unlimited re-programmability

Readback capability

Up to 12 DCM (Digital Clock Manager) modules

Precise clock de-skew

Flexible frequency synthesis

High-resolution phase shifting

•

0.15 µm 8-Layer Metal process with 0.12 µm

high-speed transistors

16 global clock multiplexer buffers

1.5 V (V_CCINT) core power supply, dedicated 3.3 V

_CCAUXauxiliary and V_CCOI/O power supplies

•

Active Interconnect™ Technology

Fourth generation segmented routing structure

Predictable, fast routing delay, independent of

fanout

•

IEEE 1149.1 compatible boundary-scan logic support

Flip-Chip and Wire-Bond Ball Grid Array (BGA)

packages in three standard fine pitches (0.80mm,

1.00mm, and 1.27mm)

SelectI/O-Ultra™ Technology

Up to 1,108 user I/Os

19 single-ended standards and six differential

standards

•

100% factory tested

Programmable sink current (2 mA to 24 mA) per I/O

All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.

DS031-1 (v1.7) October 2, 2001

Advance Product Specification

www.xilinx.com

1-800-255-7778

Module 1 of 4

Virtex-II 1.5V Field-Programmable Gate Arrays

Table 1: Virtex-II Field-Programmable Gate Array Family Members

CLB

(1 CLB = 4 slices = Max 128 bits)

SelectRAM Blocks

Maximum

System

Gates Row x Col. Slices

Array

Distributed

RAM Kbits

Multiplier 18-Kbit Max RAM

Max I/O

Device

XC2V40

Blocks

(Kbits)

DCMs Pads⁽¹⁾

40K

80K

250K

500K

8 x 8

16 x 8

256

120

200

264

432

528

624

720

912

1,104

1,108

XC2V80

512

144

XC2V250

XC2V500

XC2V1000

XC2V1500

XC2V2000

XC2V3000

XC2V4000

XC2V6000

XC2V8000

Notes:

24 x 16

32 x 24

40 x 32

48 x 40

56 x 48

64 x 56

80 x 72

96 x 88

112 x 104

1,536

3,072

5,120

7,680

10,752

14,336

23,040

33,792

46,592

432

576

160

240

336

448

720

1,056

1,456

720

1.5M

864

1,008

1,728

2,160

2,592

3,024

120

144

168

120

144

168

1. See details in Table 2, “Maximum Number of User I/O Pads”.

General Description

The Virtex-II family is a platform FPGA developed for high

performance from low-density to high-density designs that

are based on IP cores and customized modules. The family

delivers complete solutions for telecommunication, wire-

less, networking, video, and DSP applications, including

PCI, LVDS, and DDR interfaces.

Table 2 shows the maximum number of user I/Os available.

The Virtex-II device/package combination table (Table 6 at

the end of this section) details the maximum number of I/Os

for each device and package using wire-bond or flip-chip

technology.

Table 2: Maximum Number of User I/O Pads

The leading-edge 0.15µm / 0.12µm CMOS 8-layer metal

process and the Virtex-II architecture are optimized for high

speed with low power consumption. Combining a wide vari-

ety of flexible features and a large range of densities up to

10 million system gates, the Virtex-II family enhances pro-

grammable logic design capabilities and is a powerful alter-

native to mask-programmed gates arrays. As shown in

Table 1, the Virtex-II family comprises 12 members, ranging

from 40K to 10M system gates.

Device

XC2V40

Wire-Bond

Flip-Chip

XC2V80

120

XC2V250

XC2V500

XC2V1000

XC2V1500

XC2V2000

XC2V3000

XC2V4000

XC2V6000

XC2V8000

200

264

328

432

528

392

Packaging

456

624

Offerings include ball grid array (BGA) packages with

0.80mm, 1.00mm, and 1.27mm pitches. In addition to tradi-

tional wire-bond interconnects, flip-chip interconnect is used

in some of the BGA offerings. The use of flip-chip intercon-

nect offers more I/Os than is possible in wire-bond versions

of the similar packages. Flip-Chip construction offers the

combination of high pin count with high thermal capacity.

516

720

912

1,104

1,108

Module 1 of 4

www.xilinx.com

1-800-255-7778

DS031-1 (v1.7) October 2, 2001

Advance Product Specification

Virtex-II 1.5V Field-Programmable Gate Arrays

Architecture

Virtex-II Array Overview

Virtex-II devices are user-programmable gate arrays with various configurable elements. The Virtex-II architecture is

optimized for high-density and high-performance logic designs. As shown in Figure 1, the programmable device is

comprised of input/output blocks (IOBs) and internal configurable logic blocks (CLBs).

DCM

IOB

Global Clock Mux

Configurable Logic

Programmable I/Os

CLB

Block SelectRAM

Multiplier

DS031_28_100900

Figure 1: Virtex-II Architecture Overview

Programmable I/O blocks provide the interface between

package pins and the internal configurable logic. Most

popular and leading-edge I/O standards are supported by

the programmable IOBs.

All programmable elements, including the routing

resources, are controlled by values stored in static memory

cells. These values are loaded in the memory cells during

configuration and can be reloaded to change the functions

of the programmable elements.

The internal configurable logic includes four major elements

organized in a regular array.

Virtex-II Features

•

Configurable Logic Blocks (CLBs) provide functional

elements for combinatorial and synchronous logic,

including basic storage elements. BUFTs (3-state

buffers) associated with each CLB element drive

dedicated segmentable horizontal routing resources.

This section briefly describes Virtex-II features.

Input/Output Blocks (IOBs)

IOBs are programmable and can be categorized as follows:

•

Input block with an optional single-data-rate or

double-data-rate (DDR) register

•

Block SelectRAM memory modules provide large

18-Kbit storage elements of True Dual-Port RAM.

•

Output block with an optional single-data-rate or DDR

directly or through a single or DDR register

Multiplier blocks are 18-bit x 18-bit dedicated

multipliers.

DCM (Digital Clock Manager) blocks provide

self-calibrating, fully digital solutions for clock

distribution delay compensation, clock multiplication

and division, coarse and fine-grained clock phase

shifting.

•

Bi-directional block (any combination of input and

output configurations)

These registers are either edge-triggered D-type flip-flops

or level-sensitive latches.

A new generation of programmable routing resources called

Active Interconnect Technology interconnects all of these

elements. The general routing matrix (GRM) is an array of

routing switches. Each programmable element is tied to a

switch matrix, allowing multiple connections to the general

routing matrix. The overall programmable interconnection is

hierarchical and designed to support high-speed designs.

IOBs support the following single-ended I/O standards:

•

LVTTL, LVCMOS (3.3 V, 2.5 V, 1.8 V, and 1.5 V)

PCI-X at 133 MHz, PCI (3.3 V at 33 MHz and 66 MHz)

GTL and GTLP

HSTL (Class I, II, III, and IV)

DS031-1 (v1.7) October 2, 2001

Advance Product Specification

www.xilinx.com

1-800-255-7778

Module 1 of 4

Virtex-II 1.5V Field-Programmable Gate Arrays

•

SSTL (3.3 V and 2.5 V, Class I and II)

AGP-2X

A multiplier block is associated with each SelectRAM mem-

ory block. The multiplier block is a dedicated 18 x 18-bit

multiplier and is optimized for operations based on the block

SelectRAM content on one port. The 18 x 18 multiplier can

be used independently of the block SelectRAM resource.

Read/multiply/accumulate operations and DSP filter struc-

tures are extremely efficient.

The digitally controlled impedance (DCI) I/O feature auto-

matically provides on-chip termination for each I/O element.

The IOB elements also support the following differential sig-

naling I/O standards:

•

LVDS

Both the SelectRAM memory and the multiplier resource

are connected to four switch matrices to access the general

routing resources.

BLVDS (Bus LVDS)

ULVDS

Global Clocking

LDT

LVPECL

The DCM and global clock multiplexer buffers provide a

complete solution for designing high-speed clocking

schemes.

Two adjacent pads are used for each differential pair. Two or

four IOB blocks connect to one switch matrix to access the

routing resources.

Up to 12 DCM blocks are available. To generate de-skewed

internal or external clocks, each DCM can be used to elimi-

nate clock distribution delay. The DCM also provides 90-,

180-, and 270-degree phase-shifted versions of its output

clocks. Fine-grained phase shifting offers high-resolution

phase adjustments in increments of 1/256 of the clock

period. Very flexible frequency synthesis provides a clock

output frequency equal to any M/D ratio of the input clock

frequency, where M and D are two integers. For the exact

timing parameters, see Virtex™-II Electrical Characteris-

tics.

Configurable Logic Blocks (CLBs)

CLB resources include four slices and two 3-state buffers.

Each slice is equivalent and contains:

•

Two function generators (F & G)

Two storage elements

Arithmetic logic gates

Large multiplexers

Wide function capability

Fast carry look-ahead chain

Horizontal cascade chain (OR gate)

Virtex-II devices have 16 global clock MUX buffers, with up

to eight clock nets per quadrant. Each global clock MUX

buffer can select one of the two clock inputs and switch

glitch-free from one clock to the other. Each DCM block is

able to drive up to four of the 16 global clock MUX buffers.

The function generators F & G are configurable as 4-input

look-up tables (LUTs), as 16-bit shift registers, or as 16-bit

distributed SelectRAM memory.

Routing Resources

In addition, the two storage elements are either edge-trig-

gered D-type flip-flops or level-sensitive latches.

The IOB, CLB, block SelectRAM, multiplier, and DCM ele-

ments all use the same interconnect scheme and the same

access to the global routing matrix. Timing models are

shared, greatly improving the predictability of the perfor-

mance of high-speed designs.

Each CLB has internal fast interconnect and connects to a

switch matrix to access general routing resources.

Block SelectRAM Memory

There are a total of 16 global clock lines, with eight available

per quadrant. In addition, 24 vertical and horizontal long

lines per row or column as well as massive secondary and

local routing resources provide fast interconnect. Virtex-II

buffered interconnects are relatively unaffected by net

fanout and the interconnect layout is designed to minimize

crosstalk.

The block SelectRAM memory resources are 18 Kb of True

Dual-Port RAM, programmable from 16K x 1 bit to 512 x 36

bits, in various depth and width configurations. Each port is

totally synchronous and independent, offering three

"read-during-write" modes. Block SelectRAM memory is

cascadable to implement large embedded storage blocks.

Supported memory configurations for dual-port and sin-

gle-port modes are shown in Table 3.

Horizontal and vertical routing resources for each row or

column include:

Table 3: Dual-Port And Single-Port Configurations

•

24 long lines

16K x 1 bit

8K x 2 bits

4K x 4 bits

2K x 9 bits

1K x 18 bits

512 x 36 bits

120 hex lines

40 double lines

16 direct connect lines (total in all four directions)

Module 1 of 4

www.xilinx.com

DS031-1 (v1.7) October 2, 2001

1-800-255-7778

Advance Product Specification

Virtex-II 1.5V Field-Programmable Gate Arrays

Boundary Scan

Readback and Integrated Logic Analyzer

Boundary scan instructions and associated data registers

support a standard methodology for accessing and config-

uring Virtex-II devices that complies with IEEE standards

1149.1 - 1993 and 1532. A system mode and a test mode

are implemented. In system mode, a Virtex-II device per-

forms its intended mission even while executing non-test

boundary-scan instructions. In test mode, boundary-scan

test instructions control the I/O pins for testing purposes.

The Virtex-II Test Access Port (TAP) supports BYPASS,

PRELOAD, SAMPLE, IDCODE, and USERCODE non-test

instructions. The EXTEST, INTEST, and HIGHZ test instruc-

tions are also supported.

Configuration data stored in Virtex-II configuration memory

can be read back for verification. Along with the configura-

tion data, the contents of all flip-flops/latches, distributed

SelectRAM, and block SelectRAM memory resources can

be read back. This capability is useful for real-time debug-

ging.

The Integrated Logic Analyzer (ILA) core and software pro-

vides a complete solution for accessing and verifying

Virtex-II devices.

Virtex-II Device/Package Combinations

and Maximum I/O

Wire-bond and flip-chip packages are available. Table 4 and

Table 5 show the maximum possible number of user I/Os in

wire-bond and flip-chip packages, respectively. Table 6

shows the number of available user I/Os for all device/pack-

age combinations.

Configuration

Virtex-II devices are configured by loading data into internal

configuration memory, using the following five modes:

•

Slave-serial mode

Master-serial mode

•

CS denotes wire-bond chip-scale ball grid array (BGA)

(0.80 mm pitch).

Slave SelectMAP mode

Master SelectMAP mode

Boundary-Scan mode (IEEE 1532)

•

FG denotes wire-bond fine-pitch BGA (1.00 mm pitch).

FF denotes flip-chip fine-pitch BGA (1.00 mm pitch).

BG denotes standard BGA (1.27 mm pitch).

A Data Encryption Standard (DES) decryptor is available

on-chip to secure the bitstreams. One or two triple-DES key

sets can be used to optionally encrypt the configuration

information.

BF denotes flip-chip BGA (1.27 mm pitch).

The number of I/Os per package include all user I/Os except

the 15 control pins (CCLK, DONE, M0, M1, M2, PROG_B,

PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN,

DXP, AND RSVD) and VBATT.

Table 4: Wire-Bond Packages Information

Package

Pitch (mm)

CS144

0.80

FG256

1.00

FG456

1.00

FG676

1.00

BG575

1.27

BG728

1.27

Size (mm)

I/Os

12 x 12

17 x 17

172

23 x 23

324

27 x 27

484

31 x 31

408

35 x 35

516

Table 5: Flip-Chip Packages Information

Package FF896

Pitch (mm) 1.00

FF1152

1.00

FF1517

1.00

BF957

1.27

40 x 40

684

Size (mm)

I/Os

31 x 31

624

35 x 35

824

40 x 40

1,108

DS031-1 (v1.7) October 2, 2001

www.xilinx.com

Module 1 of 4

Advance Product Specification

1-800-255-7778

Virtex-II 1.5V Field-Programmable Gate Arrays

Table 6: Virtex-II Device/Package Combinations and Maximum Number of Available I/Os (Advance Information)

Available I/Os

XC2V XC2V

XC2V

250

XC2V

500

XC2V

1000

XC2V

1500

XC2V

2000

XC2V

3000

XC2V

4000

XC2V

6000

XC2V

8000

Package

CS144

FG256

FG456

FG676

FF896

120

172

200

172

264

172

324

392

528

456

624

484

720

432

328

FF1152

FF1517

BG575

BG728

BF957

Notes:

824

912

824

1,104

1,108

392

408

456

624

516

684

1. All devices in a particular package are pin-out (footprint) compatible. In addition, the FG456 and FG676 packages are compatible, as

are the FF896 and FF1152 packages.

Virtex-II Ordering Information

Virtex-II ordering information is shown in Figure 2

Example: XC2V1000-5FG456C

Device Type

Temperature Range

C = Commercial (Tj = 0˚C to +85˚C)

I = Industrial (Tj = -40˚C to +100˚C)

Speed Grade

(-4, -5, -6)

Number of Pins

Package Type

DS031_35_033001

Figure 2: Virtex-II Ordering Information

Module 1 of 4

www.xilinx.com

1-800-255-7778

DS031-1 (v1.7) October 2, 2001

Advance Product Specification

Virtex-II 1.5V Field-Programmable Gate Arrays

Revision History

This section records the change history for this module of the data sheet.

Date

Version

1.0

Revision

11/07/00

12/06/00

01/15/01

Early access draft.

Initial release.

1.1

1.2

Added values to the tables in the Virtex-II Performance Characteristics and Virtex-II

Switching Characteristics sections.

01/25/01

04/02/01

07/30/01

10/02/01

1.3

1.5

1.6

1.7

The data sheet was divided into four modules (per the current style standard).

Skipped v1.4 to sync up modules. Reverted to traditional double-column format.

Made minor changes to items listed under Summary of Virtex®-II Features.

Minor edits.

Virtex-II Data Sheet

The Virtex-II Data Sheet contains the following modules:

•

DS031-1, Virtex-II 1.5V FPGAs: Introduction and

Ordering Information (Module 1)

•

DS031-3, Virtex-II 1.5V FPGAs: DC and Switching

Characteristics (Module 3)

DS031-4, Virtex-II 1.5V FPGAs: Pinout Tables

(Module 4)

•

DS031-2, Virtex-II 1.5V FPGAs: Functional Description

(Module 2)

DS031-1 (v1.7) October 2, 2001

Advance Product Specification

www.xilinx.com

1-800-255-7778

Module 1 of 4

XC2V3000-4FG676I相关文章

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XC2V3000-4FG676I产品参数

型号:	XC2V3000-4FG676I
是否无铅：	含铅
是否Rohs认证：	不符合
生命周期：	Obsolete
零件包装代码：	BGA
包装说明：	27 X 27 MM, 1 MM PITCH, MS-034AAL-1, FBGA-676
针数：	676
Reach Compliance Code：	not_compliant
ECCN代码：	3A991.D
HTS代码：	8542.39.00.01
Factory Lead Time：	1 week
风险等级：	8.73
最大时钟频率：	650 MHz
CLB-Max的组合延迟：	0.44 ns
JESD-30 代码：	S-PBGA-B676
JESD-609代码：	e0
长度：	27 mm
湿度敏感等级：	3
可配置逻辑块数量：	3584
等效关口数量：	3000000
输入次数：	484
逻辑单元数量：	32256
输出次数：	484
端子数量：	676
组织：	3584 CLBS, 3000000 GATES
封装主体材料：	PLASTIC/EPOXY
封装代码：	BGA
封装等效代码：	BGA676,26X26,40
封装形状：	SQUARE
封装形式：	GRID ARRAY
峰值回流温度（摄氏度）：	225
电源：	1.5,1.5/3.3,3.3 V
可编程逻辑类型：	FIELD PROGRAMMABLE GATE ARRAY
认证状态：	Not Qualified
座面最大高度：	2.6 mm
子类别：	Field Programmable Gate Arrays
最大供电电压：	1.575 V
最小供电电压：	1.425 V
标称供电电压：	1.5 V
表面贴装：	YES
技术：	CMOS
端子面层：	Tin/Lead (Sn63Pb37)
端子形式：	BALL
端子节距：	1 mm
端子位置：	BOTTOM
处于峰值回流温度下的最长时间：	30
宽度：	27 mm
Base Number Matches：	1

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