ProASIC3 Device Family Overview
Advanced Flash Technology
The ProASIC3 family offers many benefits, including nonvolatility and reprogrammability through
an advanced flash-based, 130-nm LVCMOS process with seven layers of metal. Standard CMOS
design techniques are used to implement logic and control functions. The combination of fine
granularity, enhanced flexible routing resources, and abundant flash switches allows for very high
logic utilization without compromising device routability or performance. Logic functions within
the device are interconnected through a four-level routing hierarchy.
Advanced Architecture
The proprietary ProASIC3 architecture provides granularity comparable to standard-cell ASICs. The
ProASIC3 device consists of five distinct and programmable architectural features (Figure
and
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FPGA VersaTiles
Dedicated FlashROM
Dedicated SRAM/FIFO memory
†
Extensive CCCs and PLLs
Advanced I/O structure
Bank 0
CCC
RAM Block
4,608-Bit Dual-Port
SRAM or FIFO Block*
Bank 1
Bank 0
Bank 0
I/Os
VersaTile
Bank 1
ISP AES
Decryption*
User Nonvolatile
FlashROM
Bank 1
Charge Pumps
*
Not supported by A3P015 and A3P030 devices
Figure 1-1 •
ProASIC3 Device Architecture Overview with Two I/O Banks (A3P015, A3P030, A3P060, and
A3P125)
† The A3P015 and A3P030 do not support PLL or SRAM.
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ACTEL [ Actel Corporation ]
