OP177
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Internal Power Dissipation
Differential Input Voltage
Input Voltage
Output Short-Circuit Duration
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering, 60 sec)
DICE Junction Temperature (T
J
)
1
Ratings
±22 V
500 mW
±30 V
±22 V
Indefinite
−65°C to +125°C
−40°C to +85°C
300°C
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for worst-case mounting conditions, that is, θ
JA
is specified for device in socket for PDIP; θ
JA
is specified for
device soldered to printed circuit board for SOIC package.
Table 4. Thermal Resistance
Package Type
8-Lead PDIP (P-Suffix)
8-Lead SOIC (S-Suffix)
θ
JA
103
158
θ
JC
43
43
Unit
°C/W
°C/W
For supply voltages less than ±22 V, the absolute maximum input voltage is
equal to the supply voltage.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. E | Page 5 of 16
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