Data Sheet
June 1999
ORCA
Series 3C and 3T FPGAs
Pin Information
(continued)
Package Compatibility
ORCA
Series 3 FPGAs for each available package.
Each package has six dedicated configuration pins.
Tables 70—75 provide the package pin and pin function for the
ORCA
Series 3 FPGAs and packages. The bond
pad name is identified in the PIC nomenclature used in the
ORCA
Foundry design editor.
When the number of FPGA bond pads exceeds the number of package pins, bond pads are unused. When the
number of package pins exceeds the number of bond pads, package pins are left unconnected (no connects).
When a package pin is to be left as a no connect for a specific die, it is indicated as a note in the device pad column
for the FPGA. The tables provide no information on unused pads.
Table 68.
ORCA
I/Os Summary
Device
OR3T20
User I/Os*
V
DD
/V
SS
Configuration
Unused
OR3T30
User I/Os*
V
DD
/V
SS
Configuration
Unused
OR3C/T55
User I/Os*
V
DD
/V
SS
Configuration
Unused
OR3C/T80
User I/Os*
V
DD
/V
SS
Configuration
Unused
OR3T125
User I/Os*
V
DD
/V
SS
Configuration
Unused
208-Pin
SQFP/SQPF2
171
31
6
0
171
31
6
0
171
31
6
0
171
31
6
0
171
31
6
0
240-Pin
SQFP/SQFP2
192
40
6
2
192
40
6
2
192
42
6
0
192
42
6
0
192
42
6
0
256-Pin
PBGA
192
26
6
32
221
26
6
3
223
26
6
1
—
—
—
—
—
—
—
—
352-Pin
PBGA
192
48
6
106
224
48
6
74
288
48
6
10
298
48
6
0
298
48
6
0
432-Pin
EBGA
—
—
—
—
—
—
—
—
—
—
—
—
342
84
6
0
342
84
6
0
600-Pin
EBGA
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
448
140
6
6
*User I/O count includes four ExpressCLK inputs.
Lucent Technologies Inc.
153
AGERE [ AGERE SYSTEMS ]
