440GP – Power PC 440GP Embedded Processor
Revision 1.07 – October 4, 2007
Data Sheet
Package Thermal Specifications
Thermal resistance values for the CBGA and PBGA packages in a convection environment are as follows:
Airflow
ft/min (m/sec)
0 (0)
Junction-to-case thermal resistance
100 (0.51)
<0.1
1.2
17.7
20.8
200 (1.02)
<0.1
1.2
16.3
°C/W
°C/W
°C/W
°C/W
°C/W
8.0
°C/W
3
1
1, 3
2
2, 3
Parameter
Symbol
Package
Unit
Notes
θ
JC
θ
CA
θ
JB
Ceramic
Plastic
<0.1
1.2
18.9
Case-to-ambient thermal resistance (w/o heat
sink)
Ceramic
Plastic
Ceramic
Plastic
Junction-to-ball (typical)
Notes:
1. Case temperature, T
C
, is measured at top center of case surface with device soldered to circuit board.
2. The case-to-ambient thermal resistance is measured in a JEDEC JESD51-6 standard environment; and may not accurately predict
thermal performance in production equipment environments. The operational case temperature must be maintained.
3. Modeled on standard JEDEC 2S2P card, 50x50mm
56
AMCC
AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
