PPC440GP-3RC500CZ 参数 Datasheet PDF下载

Revision 1.07 – October 4, 2007

440GP – Power PC 440GP Embedded Processor

Data Sheet

Recommended DC Operating Conditions

(Continued)

Device operation beyond the conditions specified is not recommended. Extended operation beyond the recommended

conditions can affect device reliability.

Parameter

Case Temperature rating for C package

Case Temperature rating E for C package

Case Temperature rating E for F package

Notes:

Symbol

T

C

T

C

T

C

Minimum

-40

-40

-40

Typical

Maximum

+85

+105

+100

Unit

°C

°C

°C

Notes

6

6

6

1. PCI-X drivers meet PCI-X specifications.

2. SV

REF

= SV

DD

/2

3. The analog voltages used for the on-chip PLLs can be derived from the logic voltage, but must be filtered before entering the

PPC440GP. See “Absolute Maximum Ratings” on page 55.

4. During chip power-up, OV

DD

should begin to ramp before V

DD

. External voltage should not be applied to the chip I/O pins before

OV

DD

is applied to the chip. A power-down cycle should complete (OV

DD

and V

DD

should both be below 0.4V) before a new power-

up cycle is started.

5. LPDL is least positive down level; MPUL is most positive up level.

6. Case temperature, T

C

, is measured at top center of case surface with device soldered to circuit board.

Input Capacitance

Parameter

Group 1 (2.5V SSTL I/O)

Group 2 (5V tolerant LVTTL I/O)

Group 3 (PCI-X I/O)

Group 4 (Receivers)

Symbol

C

IN1

C

IN2

C

IN3

C

IN4

Maximum

12

12

12

9

Unit

pF

pF

pF

pF

Notes

DC Power Supply Loads

Parameter

V

DD

(1.8V) active operating current

OV

DD

(3.3V) active operating current

SV

DD

(2.5V) active operating current

AxV

DD

(1.8 V) input current

Symbol

I

DD

I

ODD

I

SDD

I

ADD

Minimum

Typical

915

125

560

33

Maximum

Unit

mA

mA

mA

mA

Notes

2

2

2

1, 2

Notes:

1. See “Absolute Maximum Ratings” on page 55 for filter recommendations.

2. The current values listed above are not guaranteed to be the highest obtainable. These values are dependent on many factors including

the type of applications running, clock rates, use of internal functional capabilities, external interface usage, case temperature, and the

power supply voltages. Your specific application can produce significantly different results. V

DD

(logic) current and power are primarily

dependent on the applications running and the use of internal chip functions (DMA, PCI, Ethernet, and so on). OV

DD

(I/O) current and

power are primarily dependent on the capacitive loading, frequency, and utilization of the external buses.

AMCC

59