Data Sheet AS1100
Absolute Maximum Ratings
Voltage (with respect to GND)
VDD
DIN, CLK, LOAD
All Other Pins
Current
DIG0–DIG7 Sink Current
SEGA–G, DP Source Current
Continuous Power Dissipation (TA = +85°C)
Narrow Plastic DIP (derate 13.3mW/°C above
+70°C
Wide SO (derate 11.8mW/°C above +70°C)
Operating Temperature Ranges (T
MIN
to T
MA X
)
AS1100xL
AS1100xE
Storage Temperature Range
Package body temperature
-0.3V to 6V
-0.3V to 6V
-0.3V to (VDD +0.3V)
500mA
100mA
1066mW
941mW
0°C to +70°C
-40°C to +85°C
-65°C to +150°C
+240°C
Electrical Characteristics
(VDD = 5V, R
SET
= 9.53kΩ±1%, T
A
= T
MIN
to T
MAX
, unless otherwise noted.)
Parameter
Operating Supply Voltage
Symbol Conditions
VDD
All digital inputs at VDD or GND, T
A
=
Shutdown Supply Current
IDD
SD
+25°C
R
SET
= open circuit
Operating Supply Current
IDD All segments and decimal point on, I
SEG
= -
40mA
Display Scan Rate
f
OSC
8 digits scanned
Digit Drive Sink Current
I
DIGIT
V
OUT
= 0.65V
Segment Drive Source Current
I
SEG
T
A
= +25°C, V
OUT
= (VDD -1V)
Segment Drive Current
∆I
SEG
Matching
Digit Drive Source Current
I
DIGIT
Digit off, V
DIG IT
= (VDD -0.3V)
Segment Drive Sink Current
I
SEG
Segment off, V
SEG
= 0.3V
Logic Inputs
Min
4.0
Typ
5.0
20
Max
5.5
50
500
330
500
320
-30
800
-40
3.0
-2
5
1300
-45
Units
V
µA
µA
mA
Hz
mA
mA
%
mA
mA
2
The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020B “Moisture/Reflow Sensitivity
Classification for non-hermetic Solid State Surface Mount Devices”.
Revision 1.32, Oct. 2004
Page 2 of 12
AMSCO [ AUSTRIAMICROSYSTEMS AG ]
