89
(RF Output Pad)
750
(Vd)
840
(±10 µm)
(Aux Vd)
505
2964
587
252
318
(Aux Vg2)
89 (RF Input Pad)
3050 (± 10 µm)
2323
(Vg1)
2563
(Aux Vg1)
2951
Notes:
All dimensions in microns.
Rectangular Pad Dim: 75 x 75 µm
Figure 16. AMMC-5026 Bonding Pad Locations. (dimensions in micrometers)
1.5 mil dia.Gold Wire Bond
to 15 nF DC Feedthru
68 pF Capacitor
4 nH Inductor
(1.0 mil Gold Wire Bond
with length of 200 mils)
Gold Plated Shim
2.0 mil
nom. gap
V
d
IN
OUT
V
g
Input and Output Thin Film
Circuit with 8 pF
DC Blocking Capacitor
AMMC-5026
2.0 mil
nom. gap
0.7 mil dia. Gold Bond Wire
(Length Not important)
Bonding Island
1.5 mil dia.Gold Wire Bond
to 15 nF DC Feedthru
Figure 17. AMMC-5026 Assembly Diagram.
Ordering Information
AMMC-5026-W10 = 10 devices per tray
AMMC-5026-W50 = 50 devices per tray
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-3929EN
AV02-1286EN - July 8, 2008
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
