Solder Reflow Temperature Profile
Note: Non-halide flux should be used.
Regulatory Information
The HCPL-2300 has been approved by the following or-
ganizations:
Recommended Pb-Free IR Profile
UL
Recognized under UL 1577, Component Recognition
Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5,
File CA 88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Note: Non-halide flux should be used.
Teil 2):2003-01
(Option 060 only)
Insulation and Safety Related Specifications
Parameter
Symbol
Value
Units
Conditions
Min. External Air Gap
(External Clearance)
L(IO1)
7.1
mm
Measured from input terminals to output
terminals, shortest distance through air
Min. External Tracking Path
(External Creepage)
L(IO2)
7.4
mm
mm
Measured from input terminals to output
terminals, shortest distance path along body
Min. Internal Plastic Gap
(Internal Clearance)
0.08
Through insulation distance, conductor to
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity
Tracking Resistance
(Comparative Tracking Index)
CTI
200
IIIa
Volts
DIN IEC 112/VDE 0303 PART 1
Isolation Group
Material Group (DIN VDE 0110, 1/89, Table 1)
Option 300 – surface mount classification is Class A in accordance with CECC 00802.
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