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EDE1108ACBG-5C-E 参数 Datasheet PDF下载

EDE1108ACBG-5C-E图片预览
型号: EDE1108ACBG-5C-E
PDF下载: 下载PDF文件 查看货源
内容描述: 1G位DDR2 SDRAM [1G bits DDR2 SDRAM]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 82 页 / 778 K
品牌: ELPIDA [ ELPIDA MEMORY ]
 浏览型号EDE1108ACBG-5C-E的Datasheet PDF文件第10页浏览型号EDE1108ACBG-5C-E的Datasheet PDF文件第11页浏览型号EDE1108ACBG-5C-E的Datasheet PDF文件第12页浏览型号EDE1108ACBG-5C-E的Datasheet PDF文件第13页浏览型号EDE1108ACBG-5C-E的Datasheet PDF文件第15页浏览型号EDE1108ACBG-5C-E的Datasheet PDF文件第16页浏览型号EDE1108ACBG-5C-E的Datasheet PDF文件第17页浏览型号EDE1108ACBG-5C-E的Datasheet PDF文件第18页  
EDE1104ACBG, EDE1108ACBG, EDE1116ACBG  
AC Characteristics (TC = 0°C to +85°C, VDD, VDDQ = 1.8V ± 0.1V, VSS, VSSQ = 0V) [DDR2-800, 667]  
New units tCK(avg) and nCK, are introduced in DDR2-800 and DDR2-667  
tCK(avg): actual tCK(avg) of the input clock under operation.  
nCK: one clock cycle of the input clock, counting the actual clock edges.  
-8E  
-6E  
Speed bin  
DDR2-800 (5-5-5)  
DDR2-667 (5-5-5)  
Parameter  
Symbol  
tRCD  
tRP  
min.  
12.5  
12.5  
57.5  
400  
max.  
min.  
15  
max.  
Unit  
ns  
Notes  
Active to read or write command delay  
Precharge command period  
15  
ns  
Active to active/auto-refresh command time tRC  
60  
ns  
DQ output access time from CK, /CK  
DQS output access time from CK, /CK  
CK high-level width  
tAC  
+400  
+350  
0.52  
0.52  
450  
400  
0.48  
0.48  
+450  
+400  
0.52  
0.52  
ps  
10  
10  
tDQSCK 350  
tCH (avg) 0.48  
tCL(avg) 0.48  
ps  
tCK (avg) 13  
tCK (avg) 13  
CK low-level width  
Min. (tCL(abs),  
tCH(abs))  
Min.(tCL(abs),  
tCH(abs))  
CK half period  
tHP  
ps  
ps  
6, 13  
Clock cycle time  
(CL = 6)  
tCK (avg) 2500  
8000  
3000  
8000  
13  
(CL = 5)  
tCK (avg) 2500  
tCK (avg) 3750  
tCK (avg) 5000  
tDH (base) 125  
tDS (base) 50  
8000  
8000  
8000  
3000  
3750  
5000  
175  
8000  
8000  
8000  
ps  
ps  
ps  
ps  
ps  
13  
13  
13  
5
(CL = 4)  
(CL = 3)  
DQ and DM input hold time  
DQ and DM input setup time  
100  
4
Control and Address input pulse width for  
each input  
tIPW  
0.6  
0.6  
tCK (avg)  
tCK (avg)  
DQ and DM input pulse width for each input tDIPW  
0.35  
0.35  
Data-out high-impedance time from CK,/CK tHZ  
DQS, /DQS low-impedance time from  
CK,/CK  
tAC max.  
tAC max. ps  
tAC max. ps  
tAC max. ps  
10  
10  
10  
tLZ (DQS) tAC min.  
tAC max. tAC min.  
DQ low-impedance time from CK,/CK  
tLZ (DQ) 2 × tAC min. tAC max. 2 × tAC min.  
DQS-DQ skew for DQS and associated DQ  
signals  
tDQSQ  
200  
300  
240  
340  
ps  
DQ hold skew factor  
tQHS  
tQH  
ps  
ps  
7
8
DQ/DQS output hold time from DQS  
tHP – tQHS  
tHP – tQHS  
DQS latching rising transitions to associated  
clock edges  
tDQSS  
0.25  
+0.25  
0.25  
+0.25  
tCK (avg)  
DQS input high pulse width  
DQS input low pulse width  
DQS falling edge to CK setup time  
DQS falling edge hold time from CK  
Mode register set command cycle time  
Write postamble  
tDQSH  
tDQSL  
tDSS  
0.35  
0.35  
0.2  
0.2  
2
0.35  
0.35  
0.2  
0.2  
2
tCK (avg)  
tCK (avg)  
tCK (avg)  
tCK (avg)  
nCK  
tDSH  
tMRD  
tWPST  
tWPRE  
0.4  
0.35  
0.6  
0.4  
0.35  
275  
200  
0.9  
0.4  
45  
0.6  
tCK (avg)  
tCK (avg)  
ps  
Write preamble  
Address and control input hold time  
Address and control input setup time  
Read preamble  
tIH (base) 250  
tIS (base) 175  
5
4
ps  
tRPRE  
tRPST  
tRAS  
0.9  
0.4  
45  
1.1  
1.1  
tCK (avg) 11  
tCK (avg) 12  
ns  
Read postamble  
0.6  
0.6  
Active to precharge command  
70000  
70000  
Data Sheet E1173E40 (Ver. 4.0)  
14