EDJ1104BBSE ， EDJ1108BBSE ， EDJ1116BBSE
DDR3 SDRAM模式寄存器1 [ MR1 ] ...................................................................................................... 79
DDR3 SDRAM模式寄存器2 [ MR2 ] ...................................................................................................... 80
DDR3 SDRAM模式寄存器3 [ MR3 ] ...................................................................................................... 81
突发长度（ MR0 ） .................................................................................................................................... 82
突发类型（ MR0 ） ....................................................................................................................................... 82
DLL使能（ MR1 ） ...................................................................................................................................... 83
DLL断模式.............................................................................................................................................. 83
DLL的通/断切换过程.................................................................................................................. 84
附加延迟(MR1)............................................................................................................................... 86
写调整（ MR1 ） .................................................................................................................................. 87
EO
数据表E1375E50 （版本5.0 ）
TDQS ， / TDQS功能（ MR1 ） .................................................................................................................... 90
扩展温度用法（ MR2 ） ......................................................................................................... 91
多用途注册(MR3)..................................................................................................................... 93
读时序Definition.............................................................................................................................. 101
读操作........................................................................................................................................ 105
写时序Definition.............................................................................................................................. 112
写Operation......................................................................................................................................... 113
写时序违规............................................................................................................................. 119
写数据面膜....................................................................................................................................... 120
预充电................................................................................................................................................. 121
自动预充电操作........................................................................................................................ 122
Auto-Refresh............................................................................................................................................. 123
Self-Refresh.............................................................................................................................................. 124
掉电模式................................................................................................................................... 125
在预充电掉电输入时钟频率变化......................................... ...................... 132
片上终端(ODT)........................................................................................................................ 133
ZQ Calibration........................................................................................................................................... 145
在DDR3 SDRAM的操作................................................................................................................101
包装图......................................................................................................................................147
78球FBGA ............................................................................................................................................ 147
96球FBGA ............................................................................................................................................ 148
推荐焊接Conditions........................................................................................................149
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ELPIDA [ ELPIDA MEMORY ]
