R
V6108
Side view and recommended Solder Area
Fig.12
Package and Ordering Information
The V6108 is available in the following packages:
When ordering, please specify the complete part number
and package.
QFP52, pin plastic package
TAB, tape automated bonding
Chip form
V6108 52F
V6108 TAB
V6108 Chip *
*on request
EM Microelectronic-Marin SA cannot assume responsibility for use of any circuitry described other than circuitry
entirely embodied in an EM Microelectronic-Marin SA product. EM Microelectronic-Marin SA reserves the right to
change the circuitry and specifications without notice at any time. You are strongly urged to ensure that the
information given has not been superseded by a more up-to-date version.
© EM Microelectronic-Marin SA, 09/04, Rev.C
Copyright © 2004, EM Microelectronic-Marin SA
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www.emmicroelectronic.com