epc3xx
Layout Information
(all measures in mm,
Package
CSP4
Part Name
Thi s document is confidential and pr otected by law and internati onal trades. It must not be shown to any thir d party nor be copied in any form without our written per mission
.
)
Mechanical Dimensions
Designed
Approved
Scale
Page
<Name>
<Name>
M 1:1
1
26.02.2009
<Data>
DIN A4
Layout Recommendations
0.10
Part No.
<Partname>
File: Unbenannt
Bottom View
0.14
<x000 000>
max 0.10
Top View
max. 0.1524
∅
0.30
1.00 +0.00/-0.10
3
4
0.50
0.50
0.50
1.00
no solder mask inside this area
0.50
1.00 +0.00/-0.10
photosensitive area
Solder balls
Sn97.5Ag2.5
0.05
0.40
CSP8
Bottom View
0.14
0.26 ±0.04
max 0.10
Top View
max. 0.1524
∅
0.30
photo diode area
0.50
photo diode area
2.00 ±0.00/-0.10
0.50
0.50
photo diode area
photo diode area
0.50
0.50
1.00
no solder mask inside this area
0.50
0.50
1.00 ±0.00/-0.10
photosensitive area
Solder balls
Sn97.5Ag2.5
0.05
0.26 ±0.04
© 2011 ESPROS Photonics Corporation
Characteristics subject to change without notice
7
Datasheet epc3xx - V2.3
www.espros.ch
0.50
2.00
1.00
2
1
0.90
photo diode photo diode
area
area
4
3
2
1
5
6
7
8
EPC [ ESPROS PHOTONICS CORP ]
