MMDL101T1
PACKAGE DIMENSIONS
SOD–323
PLASTIC PACKAGE
CASE 477–02
ISSUE A
K
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH
SOLDER PLATING.
MILLIMETERS
DIM
E
D
1
2
B
INCHES
MIN
MAX
0.063
0.071
0.045
0.053
0.031
0.039
0.010
0.016
0.006 REF
0.000
0.004
0.0035
0.0070
0.091
0.106
C
J
NOTE 3
H
A
B
C
D
E
H
J
K
MIN
MAX
1.60
1.80
1.15
1.35
0.80
1.00
0.25
0.40
0.15 REF
0.00
0.10
0.089
0.177
2.30
2.70
0.63 mm
0.025’’
STYLE 1:
PIN 1. CATHODE
2. ANODE
1.60 mm
0.063’’
2.85 mm
0.112’’
mm
inches
0.83 mm
0.033’’
(
)
SOD–323
Soldering Footprint
S1–3/3
ETL [ E-TECH ELECTRONICS LTD ]
