欢迎访问ic37.com |
会员登录 免费注册
发布采购

IRL2703S 参数 Datasheet PDF下载

IRL2703S图片预览
型号: IRL2703S
PDF下载: 下载PDF文件 查看货源
内容描述: 1.5 A开关模式电源与线性稳压器 [1.5 A Switch-Mode Power Supply with Linear Regulator]
分类和应用: 稳压器开关
文件页数/大小: 38 页 / 739 K
品牌: FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
 浏览型号IRL2703S的Datasheet PDF文件第1页浏览型号IRL2703S的Datasheet PDF文件第2页浏览型号IRL2703S的Datasheet PDF文件第3页浏览型号IRL2703S的Datasheet PDF文件第4页浏览型号IRL2703S的Datasheet PDF文件第6页浏览型号IRL2703S的Datasheet PDF文件第7页浏览型号IRL2703S的Datasheet PDF文件第8页浏览型号IRL2703S的Datasheet PDF文件第9页  
MAXIMUM RATINGS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Rating
Electrical Ratings
Supply Voltage
Switching Node Voltage
Buck Regulator Bootstrap Input Voltage (BOOT - SW)
Boost Regulator Output Voltage
Boost Regulator Drain Voltage
RST
Drain Voltage
Symbol
Value
Unit
V
IN1
, V
IN2
V
SW
V
IN(BOOT)
V
BST
V
BD
V
RST
-0.3 to 7.0
-1.0 to 7.0
-0.3 to 8.5
-0.3 to 8.5
-0.3 to 9.5
-0.3 to 7.0
-0.3 to 7.0
-0.3 to 7.0
V
V
V
V
V
V
V
V
V
Enable Terminal Voltage at EN1, EN2
Logic Terminal Voltage at SDA, SCL
Analog Terminal Voltage
LDO, VOUT,
RST
LDRV, LCMP, CS
Terminal Voltage at CLKSEL, ADDR, RT, FREQ, VDDI, CLKSYN, INV,
LFB
ESD Voltage
Human Body Model
Machine Model
Thermal Ratings
Storage Temperature
Lead Soldering Temperature
Maximum Junction Temperature
Thermal Resistance
Junction to Ambient (Single Layer)
Junction to Ambient (Four Layers)
Thermal Resistance, Junction to Base
Operational Package Temperature (Ambient Temperature)
V
EN
V
LOG
V
OUT
V
LIN
V
LOGIC
-0.3 to 7.0
-0.3 to 8.5
-0.3 to 3.6
V
V
V
ESD
±2000
±200
T
STG
T
SOLDER
T
JMAX
R
θJA
-65 to 150
260
125
°C
°C
°C
°C/W
70
55
R
θJB
T
A
18
-40 to 85
°C/W
°C
Notes
1. ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
=100 pF, R
ZAP
=1500
Ω),
ESD2 testing is performed in
accordance with the Machine Model (C
ZAP
=200 pF, R
ZAP
=0
Ω),
and the Charge Device Model.
2. Lead soldering temperature limit is for 10 seconds maximum duration.
3. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board and board thermal resistance.
4. Per JEDEC JESD51-6 with the board horizontal
5. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
34701
Analog Integrated Circuit Device Data
Freescale Semiconductor
5