.
+5.0 V
Die
P1
Stainless
Steel Cap
Thermoplastic
Case
V
S
Pin 2
MPXA6115A
MPXH6115A
V
out
Pin 4
GND Pin 3
Absolute Element
Sealed Vacuum Reference
Die Bond
47 pF
to ADC
Fluoro Silicone
Gel Die Coat
Wire Bond
Lead
Frame
100 nF
51 K
Figure 2. Cross Sectional Diagram SSOP (Not to Scale)
Figure 3. Typical Application Circuit
(Output Source Current Operation)
5.0
4.5
4.0
3.5
Output (Volts)
3.0
2.5
2.0
1.5
1.0
0.5
0
Transfer Function:
V
out
= V
s
* (.009*P-.095) ± Error
V
S
= 5.0 Vdc
TEMP = 0 to 85ºC
MAX
TYP
MIN
Figure 4. Output versus Absolute Pressure
Figure 2
illustrates the absolute sensing chip in the basic
Super Small Outline chip carrier (Case 1317).
shows a typical application circuit (output source
current operation).
shows the sensor output signal relative to
pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85×C temperature
range. The output will saturate outside of the rated pressure
range.
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MPXA6115A/
MPXH6115A series pressure sensor operating
characteristics, internal reliability and qualification tests are
based on use of dry air as the pressure media. Media other
than dry air may have adverse effects on sensor performance
and long-term reliability. Contact the factory for information
regarding media compatibility in your application.
MPXA6115A
4
Sensors
Freescale Semiconductor
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
110
115
120
Pressure (ref: to sealed vacuum) in kPa
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
