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GM76V256CLLET-10 参数 Datasheet PDF下载

GM76V256CLLET-10图片预览
型号: GM76V256CLLET-10
PDF下载: 下载PDF文件 查看货源
内容描述: [Standard SRAM, 32KX8, 100ns, CMOS, PDSO28, 8 X 13.40 MM, TSOP1-28]
分类和应用: 静态存储器光电二极管内存集成电路
文件页数/大小: 10 页 / 136 K
品牌: HYNIX [ HYNIX SEMICONDUCTOR ]
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GM76V256C Series
Notes(WRITE CYCLE):
1. A write occurs during the overlap of a low /CS and a low /WE. A write begins at the latest transition
among /CS going low and /WE going low: A write ends at the earliest transition among /CS going high
and /WE going high. t
WP
is measured from the beginning of write to the end of write.
2. t
CW
is measured from the later of /CS going low to the end of write .
3. t
AS
is measured from the address valid to the beginning of write.
4. t
WR
is measured from the end of write to the address change. t
WR is
applied in case a write ends as /CS,
or /WE going high.
5. If /OE and /WE are in the read mode during this period, and the I/O pins are in the output low-Z state,
input of opposite phase of the output must not be applied because bus contention can occur.
6. If /CS goes low simultaneously with /WE going low, or after /WE going low, the outputs remain in high
impedance state.
7. D
OUT
is the same phase of the latest written data in this write cycle.
8. D
OUT
is the read data of the new address.
DATA RETENTION CHARACTERISTIC
TA=0°C to 70°C (Normal)
Symbol
Parameter
V
DR
Vcc for Data Retention
I
CCDR
Data Retention Current
Test Condition
CS>Vcc-0.2V,
Vss<V
IN
<Vcc
Vcc=3.0V,
L
/CS>Vcc - 0.2V, LL
Vss<V
IN
<Vcc
LE
LLE
See Data Retention
Timing Diagram
Min
2.0
-
-
-
-
0
tRC
(2)
Typ
-
1
0.5
1
0.5
-
-
Max
-
15
7
20
10
-
-
Unit
V
uA
uA
uA
uA
ns
ns
tCDR
tR
Chip Deselect to Data Retention Time
Operating Recovery Time
Notes
1. Typical values are under the condition of T
A
= 25°C.
2. tRC is read cycle time.
DATA RETENTION TIMING DIAGRAM
VCC
3.0V
tCDR
DATA RETENTION MODE
tR
2.2V
VDR
CS>VCC-0.2V
CS
VSS
Rev 00 / Jul. 2000
7