28F640L30, 28F128L30, 28F256L30
2.3
Ballout Diagrams for Intel
®
Stacked Chip Scale Package
The 1.8 Volt Intel StrataFlash
®
wireless memory in Quad+ ballout device is available in an 88-ball
(80-active ball) Intel
®
Stacked Chip Scale Package for the 128-Mbit device and in an 88-ball (80-
active ball) Intel
®
Ultra-Thin Stacked Chip Scale Package for the 256-Mbit device.
shows
the signal ballout. Refer to Section 5.0 for Mechanical Package Information.
Figure 3. 88-Ball (80-Active Ball) Stacked-CSP Package Ballout
1
2
3
4
5
6
7
8
A
DU
DU
DU
DU
B
A4
A18
A19
VSS
F1 -V CC
F2 -V C C
A2 1
A11
C
A5
R -L B#
A23
VSS
S -CS 2
C LK
A2 2
A12
D
A3
A17
A24
F-V P P ,
F -V P E N
R -W E #
P 1 -CS #
A9
A13
E
A2
A7
A25
F-W P #
A DV #
A 20
A1 0
A15
F
A1
A6
R -U B #
F -R S T#
F-W E #
A8
A1 4
A16
G
A0
D8
D2
D10
D5
D 13
W A IT
F 2 -CE #
H
R -O E #
D0
D1
D3
D1 2
D 14
D7
F2 - O E #
J
S -CS 1 #
F1 -O E #
D9
D11
D4
D6
D1 5
VCCQ
K
F1 -C E #
P 2 -CS #
F3 -C E #
S -V CC
P -V C C
F2 -V C C
V CC Q
P - M o de
L
VSS
VSS
DU
V CCQ
F 1 -V C C
VSS
VSS
VS S
DU
VSS
DU
M
DU
T o p V ie w - B a ll S id e D o w n
Legend:
G lo b a l
S R A M /P S R A M s p e c ific
F la s h s p e c ific
Datasheet
11
INTEL [ INTEL CORPORATION ]
