ADVANCE
512Mb: x4, x8, x16
DDR SDRAM
PIN DESCRIPTIONS (continued)
TSOP PIN NUMBERS
2, 5, 8, 11, 56, 59, 62, 65
5, 11, 56, 62
51
16, 51
SYMBOL
DQ0-7
DQ0-3
DQS
LDQS, UDQS
TYPE
I/O
I/O
I/O
DESCRIPTION
Data Input/Output: Data bus for x8 (2, 8, 59 and 65 are NC for x4).
Data Input/Output: Data bus for x4.
Data Strobe: Output with read data, input with write data. DQS is
edge-aligned with read data, centered in write data. It is used to
capture data. For the x16 , LDQS is DQS for DQ0-DQ7 and UDQS is
DQS for DQ8-DQ15. Pin 16 is NC on x4 and x8.
Do Not Use: Must float to minimize noise.
DQ Power Supply: +2.5V ±0.2V. Isolated on the die for improved
noise immunity.
DQ Ground. Isolated on the die for improved noise immunity.
Power Supply: +2.5V ±0.2V.
Ground.
SSTL_2 reference voltage.
No Connect: These pins should be left unconnected.
50
3, 9, 15, 55, 61
6, 12, 52, 58, 64
1, 18, 33
34, 48, 66
49
14, 17, 19, 25, 43, 53
DNU
V
DD
Q
V
SS
Q
V
DD
V
SS
V
REF
NC
–
Supply
Supply
Supply
Supply
Supply
–
RESERVED NC PINS
1
TSOP PIN NUMBERS
17
SYMBOL
A13
TYPE
I
DESCRIPTION
Address input for 1Gb devices.
NOTE:
1. NC pins not listed may also be reserved for other uses now or in the future. This table simply defines specific NC pins
deemed to be of importance.
512Mb: x4, x8, x16 DDR SDRAM
512Mx4x8x16DDR_B.p65 – Rev. B; Pub 4/01
8
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2001, Micron Technology, Inc.
MICRON [ MICRON TECHNOLOGY ]
