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MT46V64M16 参数 Datasheet PDF下载

MT46V64M16图片预览
型号: MT46V64M16
PDF下载: 下载PDF文件 查看货源
内容描述: 双倍数据速率( DDR ) SDRAM [DOUBLE DATA RATE (DDR) SDRAM]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 74 页 / 2303 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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PRELIMINARY  
1Gb : x4, x8, x16  
DDR SDRAM  
for each burst type in the Operation section of this  
data sheet. The user must not issue another command  
to the sam e bank until the precharge tim e (tRP) is  
completed.  
JEDEC requirement by one clock. This maximum  
absolute interval is to allow future support for DLL  
updates internal to the DDR SDRAM to be restricted to  
AUTO REFRESH cycles, without allowing excessive  
t
drift in AC between updates.  
Although not a JEDEC requirem ent, to provide for  
future functionality features, CKE must be active  
(High) during the AUTO REFRESH period. The AUTO  
REFRESH period begins when the AUTO REFRESH  
command is registered and ends tRFC later.  
BURST TERMINATE  
The BURST TERMINATE com m and is used to trun-  
cate read bursts (with auto precharge disabled). The  
most recently registered READ command prior to the  
BURST TERMINATE comm and will be truncated, as  
shown in the Operation section of this data sheet. The  
open page which the READ burst was terminated from  
remains open.  
SELF REFRESH  
The SELF REFRESH command can be used to retain  
data in the DDR SDRAM, even if the rest of the system  
is powered down. When in the self refresh mode, the  
DDR SDRAM retains data without external clocking.  
The SELF REFRESH command is initiated like an  
AUTO REFRESH com m and except CKE is disabled  
(LOW). The DLL is automatically disabled upon enter-  
ing SELF REFRESH and is automatically enabled upon  
exiting SELF REFRESH (A DLL reset and 200 clock  
cycles must then occur before a READ command can  
be issued). Input signals except CKE are “Dont Care”  
during SELF REFRESH. VREF voltage is also required  
for the SELF REFRESH full duration.  
AUTO REFRESH  
AUTO REFRESH is used during norm al operation of  
the DDR SDRAM and is analogous to CAS#-BEFORE-  
RAS# (CBR) refresh in FPM/ EDO DRAMs. This com-  
m and is nonpersistent, so it m ust be issued each tim e  
a refresh is required. All banks m ust be idle before an  
AUTO REFRESH com m and is issued.  
The addressing is generated by the internal refresh  
controller. This makes the address bits a “Dont Care”  
during an AUTO REFRESH command. The 1Gb DDR  
SDRAM requires AUTO REFRESH cycles at an average  
interval of 7.8125µs (maximum).  
The procedure for exiting self refresh requires a  
sequence of commands. First, CK and CK# must be  
stable prior to CKE going back HIGH. Once CKE is  
HIGH, the DDR SDRAM must have NOP commands  
issued for tXSNR because time is required for the com-  
pletion of any internal refresh in progress. A sim ple  
algorithm for m eeting both refresh and DLL require-  
To allow for improved efficiency in scheduling and  
switching between tasks, some flexibility in the abso-  
lute refresh interval is provided. A maximum of eight  
AUTO REFRESH com m ands can be posted to any  
given DDR SDRAM, m eaning that the m axim um abso-  
lute interval between any AUTO REFRESH com m and  
and the next AUTO REFRESH command is 9 x 7.8125µs  
(70.3µs). Note the JEDEC specifications only allows 8 x  
7.8125µs, thus the Micron specification exceeds the  
t
m ents is to apply NOPs for XSNR time, then a DLL  
Reset and NOPs for 200 additional clock cycles before  
applying any other command.  
09005aef8076894f  
1gbDDRx4x8x16_2.fm - Rev. A 3/03 EN  
Micron Technology, Inc., reserves the right to change products or specifications without notice.  
©2003 Micron Technology. Inc.  
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