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MT46V64M16 参数 Datasheet PDF下载

MT46V64M16图片预览
型号: MT46V64M16
PDF下载: 下载PDF文件 查看货源
内容描述: 双倍数据速率( DDR ) SDRAM [DOUBLE DATA RATE (DDR) SDRAM]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 74 页 / 2303 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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PRELIMINARY  
1Gb : x4, x8, x16  
DDR SDRAM  
command, where x equals the number of desired data  
elem ent pairs (pairs are required by the 2n-prefetch  
architecture). This is shown in Figure 12 on page 22. A  
READ command can be initiated on any clock cycle  
following a previous READ com m and. Nonconsecutive  
read data is shown for illustration in Figure 13 on  
page 23. Full-speed random read accesses within a  
page (or pages) can be performed as shown in  
Figure 14 on page 24.  
Data from any READ burst may be truncated with a  
BURST TERMINATE command, as shown in Figure 15  
on page 25. The BURST TERMINATE latency is equal  
to the read (CAS) latency, i.e., the BURST TERMINATE  
command should be issued x cycles after the READ  
command, where x equals the number of desired data  
elem ent pairs (pairs are required by the 2n-prefetch  
architecture).  
READs  
READ bursts are initiated with a READ command, as  
shown in Figure 10 on page 20.  
The starting colum n and bank addresses are pro-  
vided with the READ com m and and auto precharge is  
either enabled or disabled for that burst access. If auto  
precharge is enabled, the row being accessed is pre-  
charged at the completion of the burst.  
NOTE: For the READ commands used in the follow-  
ing illustrations, auto precharge is disabled.  
During READ bursts, the valid data-out elem ent  
from the starting column address will be available fol-  
lowing the CAS latency after the READ command.  
Each subsequent data-out element will be valid nomi-  
nally at the next positive or negative clock edge (i.e., at  
the next crossing of CK and CK#). Figure 11 on page 21  
shows general timing for each possible CAS latency  
setting. DQS is driven by the DDR SDRAM along with  
output data. The initial LOW state on DQS is known as  
the read preamble; the LOW state coincident with the  
last data-out elem ent is known as the read postamble.  
Upon completion of a burst, assuming no other  
com m ands have been initiated, the DQs will go High-  
Data from any READ burst must be completed or  
truncated before a subsequent WRITE comm and can  
be issued. If truncation is necessary, the BURST TER-  
MINATE command must be used, as shown in  
Figure 16 on page 26. The tDQSS (NOM) case is shown;  
the tDQSS (MAX) case has a longer bus idle time.  
t
(tDQSS [MIN] and DQSS [MAX] are defined in the sec-  
t
Z. A detailed explanation of DQSQ (valid data-out  
tion on WRITEs.)  
skew), tQH (data-out window hold), the valid data win-  
dow are depicted in Figure 38 on page 60 and Figure 39  
A READ burst m ay be followed by, or truncated with,  
a PRECHARGE com m and to the sam e bank provided  
that auto precharge was not activated. The PRE-  
CHARGE com m and should be issued x cycles after the  
READ command, where x equals the number of  
desired data elem ent pairs (pairs are required by the  
2n-prefetch architecture). This is shown in Figure 17  
on page 27. Following the PRECHARGE command, a  
subsequent command to the same bank cannot be  
t
on page 61. A detailed explanation of DQSCK (DQS  
transition skew to CK) and AC (data-out transition  
skew to CK) is depicted in Figure 40 on page 62.  
t
Data from any READ burst may be concatenated  
with or truncated with data from a subsequent READ  
command. In either case, a continuous flow of data  
can be m aintained. The first data elem ent from the  
new burst follows either the last element of a com-  
pleted burst or the last desired data element of a longer  
burst which is being truncated. The new READ com-  
mand should be issued x cycles after the first READ  
t
t
issued until both RAS and RP has been met. Note that  
part of the row precharge tim e is hidden during the  
access of the last data elements.  
09005aef8076894f  
1gbDDRx4x8x16_2.fm - Rev. A 3/03 EN  
Micron Technology, Inc., reserves the right to change products or specifications without notice.  
©2003 Micron Technology. Inc.  
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