512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM
Package Dimensions
Package Dimensions
Figure 55:
54-Ball VFBGA (10mm x 11.5mm)
0.65 ±0.05
Seating
plane
0.1 A
A
Solder ball
material:
SAC305
(96.5%
Sn,
3% Ag, 0.5%
Cu)
or
SAC105
(98.5%
Sn,
1% Ag, 0.5%
Cu)
Substrate
material: plastic laminate
54X Ø0.45
Dimensions
apply to solder
balls
post reflow.
Pre-reflow
balls
are Ø0.42 on
Ø0.40
SMD ball
pads.
10 ±0.10
5 ±0.05
Ball A1 ID
9
8
7
3
2
1
Mold
compound:
epoxy novolac
Ball A1 ID
A
B
5.75 ±0.05
3.2
6.4
C
D
E
F
G
H
11.5 ±0.1
0.8 TYP
J
0.8 TYP
6.4
3.2
1.0 MAX
Notes:
1. All dimensions are in millimeters.
2. Green packaging composition is available upon request.
PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03
MT48H32M16LF_1.fm - Rev. H 6/07 EN
72
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2005 Micron Technology, Inc. All rights reserved.
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