512Mb : 32 Me g x 16, 16 Me g x 32 Mo b ile SDRAM
Pa cka g e Dim e n sio n s
Fig u re 56: 90-Ba ll VFBGA (10m m x 13m m )
0.65 ±0.05
Seating
plane
A
Solder ball material:
SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
0.1 A
90X Ø0.45
Dimensions apply
to solder balls post
Substrate material: plastic laminate
Mold compound: epoxy novolac
10 ±0.1
reflow. The pre-
reflow balls are
Ø0.42 on Ø0.40
SMD ball pads.
Ball A1 ID
Ball A1 ID
5 ±0.05
9
8
7
3
2
1
A
B
C
D
E
F
6.5 ±0.05
5.6
G
H
J
11.2
13 ±0.1
K
L
M
N
P
0.8 TYP
R
0.8 TYP
3.2
6.4
1.0 MAX
Notes: 1. All dimensions are in millimeters.
2. Green packaging composition is available upon request.
®
8000 S. Fe d e ra l Wa y, P.O. Bo x 6, Bo ise , ID 83707-0006, Te l: 208-368-3900
p ro d m kt g @m icro n .co m w w w .m icro n .co m Cu st o m e r Co m m e n t Lin e : 800-932-4992
Micro n , t h e M lo g o , t h e Micro n lo g o , a n d En d u r-IC a re t ra d e m a rks o f Micro n Te ch n o lo g y, In c. All o t h e r t ra d e m a rks a re t h e
p ro p e rt y o f t h e ir re sp e ct ive o w n e rs.
Th is d a t a sh e e t co n t a in s m in im u m a n d m a xim u m lim it s sp e cifie d o ve r t h e co m p le t e p o w e r su p p ly a n d t e m p e ra t u re ra n g e
fo r p ro d u ct io n d e vice s. Alt h o u g h co n sid e re d fin a l, t h e se sp e cifica t io n s a re su b je ct t o ch a n g e , a s fu rt h e r p ro d u ct
d e ve lo p m e n t a n d d a t a ch a ra ct e riza t io n so m e t im e s o ccu r.
PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03
MT48H32M16LF_1.fm - Rev. H 6/07 EN
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2005 Micron Technology, Inc. All rights reserved.
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