PS2503-1, -2, -4, PS2503L-1, -2, -4
SOLDERING PRECAUTION
(1) Infrared reflow soldering
•
•
•
•
Peak reflow temperature
Reflow time
Number of reflow processes
Flux
: 235
°C
or below (Plastic surface temperature)
: 30 seconds or less (Time period during which the plastic surface
temperature is 210
°C)
: Three
: Rosin flux containing small amount of chlorine
(The flux with a maximum chlorine content of 0.2 Wt % is recommended.)
REFLOW TEMPERATURE PROFILE
PACKAGE’S SURFACE TEMPERATURE (
o
C)
(ACTUAL HEAT)
to 10 s
235
o
C MAX
210
o
C
120 to 160
o
C
to 30 s
60 to 90 s
(PRE-HEAT)
TIME (s)
Peak Temperature 235 °C or Lower
(2) Dip soldering
•
•
•
Peak temperature
Time
Flux
: 260
°C
or lower
: 10 s or less
: Rosin-base flux
5
NEC [ NEC ]
