5076 series
SERIES CONFIGURATION
Operating
supply voltage
range [V]
PAD layout
Recommended
operating frequency
range
*1
[MHz]
20 to 40
Flip Chip Bonding
40 to 55
1.6 to 2.0
20 to 40
Wire Bonding
40 to 55
5076BJ
(5076BK)
(5076BL)
(5076BM)
(5076BN)
*1. The recommended operating frequency is a yardstick value derived from the crystal used for NPC characteristics authentication. However, the oscil-
lation frequency range is not guaranteed. Specifically, the characteristics can vary greatly due to crystal characteristics and mounting conditions, so
the oscillation characteristics of components must be carefully evaluated.
*2. Versions in parentheses ( ) are under development.
5076B1
(5076B2)
(5076B3)
(5076B4)
(5076B5)
(5076AJ)
(5076AK)
(5076AL)
(5076AM)
(5076AN)
Output frequency and version name
*2
f
O
output
(5076A1)
f
O
/2 output
(5076A2)
f
O
/4 output
(5076A3)
f
O
/8 output
(5076A4)
f
O
/16 output
(5076A5)
VERSION NAME
Device
WF5076
××
–4
Package
Wafer form
Version name
WF5076
Form WF: Wafer form
CF: Chip (Die) form
−4
Oscillation frequency range, frequency divider function
Pad layout type A: for Flip Chip Bonding
B: for Wire Bonding
CF5076××–4
Chip form
SEIKO NPC CORPORATION —2
NPC [ NIPPON PRECISION CIRCUITS INC ]
