M25P16
Revision history
13
Revision history
Table 23.
Date
16-Jan-2002
Document revision history
Revision
0.1
Changes
Target Specification Document written
Clarification of descriptions of entering Standby Power mode from Deep
Power-down mode, and of terminating an instruction sequence or data-
out sequence.
ICC2(max) value changed to 10µA
Typical Page Program time improved. Write Protect setup and hold times
specified, for applications that switch Write Protect to exit the Hardware
Protection mode immediately before a WRSR, and to enter the Hardware
Protection mode again immediately after
MLP8 package added
50MHz operation, and RDID instruction added. Published internally, only
8x6 MLP8 and SO16(300 mil) packages added
t
PP
, t
SE
and t
BE
revised. SO16 package code changed. Output Timing
Reference Voltage changed. Document promoted to Preliminary Data.
Table of contents, warning about exposed paddle on MLP8, and Pb-free
options added.
Value of t
VSL
(min) and t
BE
(typ) changed. Change of naming for VDFPN8
packages. Document promoted to full Datasheet.
MLP8(5x6) package removed. Soldering temperature information
clarified for RoHS compliant devices. Device Grade clarified
Notes 1 and 2 removed from
Small text changes.
and
instructions,
and
paragraph clarified.
Updated Page Program (PP) instructions in
and Table 15: AC characteristics (Grade 6).
VFQFPN8 package added (see
and
All packages are ECOPACK®. “Blank” option removed under
Plating
Technology.
SO8 Narrow and SO8 Wide packages added (see
VDFPN8 package updated (see
added to
updated and
Note 2
added. SO8N package specifications updated (see
and
Small text changes.
23-Apr-2002
0.4
13-Dec-2002
0.5
0.6
15-May-2003
0.7
20-Jun-2003
24-Sep-2003
0.8
1.0
24-Nov-2003
2.0
17-May-2004
3.0
01-Apr-2005
4.0
01-Aug-2005
5.0
20-Oct-2005
6.0
27-Feb-2006
7
04-Jul-2006
8
53/55
NUMONYX [ NUMONYX B.V ]
