P4C1024
Temperature
Range
Commercial
Package
Plastic DIP (300 mil)
Plastic SOJ (300 mil)
Plastic SOJ (400 mil)
Speed
55
N/A
N/A
N/A
N/A
N/A
N/A
-55C6M
-55C4M
-55FSM
-55LM
-55CJM
-55C6MB
-55C4MB
-55FSMB
-55LMB
-55CJMB
70
N/A
N/A
N/A
N/A
N/A
N/A
-70C6M
-70C4M
-70FSM
-70LM
-70CJM
-70C6MB
-70C4MB
-70FSMB
-70LMB
-70CJMB
85
N/A
N/A
N/A
N/A
N/A
N/A
-85C6M
-85C4M
-85FSM
-85LM
-85CJM
-85C6MB
-85C4MB
-85FSMB
-85LMB
-85CJMB
100
N/A
N/A
N/A
N/A
N/A
N/A
-100C6M
-100C4M
-100FSM
-100LM
-100CJM
-100C6MB
-100C4MB
-100FSMB
-100LMB
-100CJMB
120
N/A
N/A
N/A
N/A
N/A
N/A
-120C6M
-120C4M
-120FSM
-120LM
-120CJM
-120C6MB
-120C4MB
-120FSMB
-120LMB
-120CJMB
Industrial
Plastic DIP (300 mil)
Plastic SOJ (300 mil)
Plastic SOJ (400 mil)
Military
Temperature
Ceramic DIP (600 mil)
Ceramic DIP (400 mil)
Solder Seal Flatpack
LCC (450 x 550 mil)
Ceramic SOJ
Military
Processed*
Ceramic DIP (600 mil)
Ceramic DIP (400 mil)
Solder Seal Flatpack
LCC (450 x 550 mil)
Ceramic SOJ
* Military temperature range with MIL-STD-883, Class B compliance.
N/A = Not Available
Document #
SRAM124
REV A
Page 9 of 14
PYRAMID [ PYRAMID SEMICONDUCTOR CORPORATION ]
