Internet Data Sheet
HYS[64/72]T[16/32/64]0xxHU–[2.5/../5]–A
Unbuffered DDR2 SDRAM Modules
Product Type
1)
PC2–3200
HYS64T16000HU–5–A
HYS64T32001HU–5–A
HYS72T32000HU–5–A
Compliance Code
2)
128MB 1Rx16 PC2–3200U–333–11–C1
256MB 1Rx8 PC2–3200U–333–11–A1
256MB 1Rx8 PC2–3200E–333–11–A1
Description
1 Rank, Non-ECC
1 Rank, Non-ECC
1 Rank, ECC
SDRAM Technology
256 Mbit (x16)
256 Mbit (x8)
256 Mbit (x8)
1) All product types end with a place code, designating the silicon die revision. Example: HYS64T16000HU–3.7–A, indicating Rev. “A” dies
are used for DDR2 SDRAM components. For all QIMONDA DDR2 module and component nomenclature see
of this data sheet.
2) The Compliance Code is printed on the module label and describes the speed grade, for example “PC2–4200U–444–11–C1”, where
4200U means Unbuffered DIMM modules with 4.26 GB/sec Module Bandwidth and “444-11” means Column Address Strobe (CAS)
latency = 4, Row Column Delay (RCD) latency = 4 and Row Precharge (RP) latency = 4 using the latest JEDEC SPD Revision 1.1 and
produced on the Raw Card “C”.
TABLE 3
Address Format
DIMM
Density
128 MByte
256 MByte
512 MByte
Module
Organization
16M
×
64
32M
×
64
32M
×
72
64M
×
64
64M
×
72
Memory
Ranks
1
1
1
2
2
ECC/
Non-ECC
Non-ECC
Non-ECC
ECC
Non-ECC
ECC
# of SDRAMs # of row/bank/column
bits
4
8
9
16
18
13/2/9
13/2/10
13/2/10
13/2/10
13/2/10
Raw
Card
C
A,D
A,F
E
G
TABLE 4
Components on Modules
Product Type
1)
HYS64T16000HU
HYS64T32001HU
HYS64T64020HU
HYS72T32000HU
HYS72T64020HU
DRAM Components
HYB18T256160AF
HYB18T256800AF
HYB18T256800AF
HYB18T256800AF
HYB18T256800AF
DRAM Density
256 Mbit
256 Mbit
256 Mbit
256 Mbit
256 Mbit
DRAM Organisation
16M
×
16
32M
×
8
32M
×
8
32M
×
8
32M
×
8
Note
2)
1) Green Product
2) For a detailed description of all functionalities of the DRAM components on these modules see the component data sheet.
Rev. 1.41, 2006-11
03062006-0GN5-WTPW
5
QIMONDA [ QIMONDA AG ]
