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S3C6410X_UM_REV0.00
S3C6410X66-YB40
PRODUCT OVERVIEW
1.1.3.2 DRAM port configurable to support the following memory types:
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SDRAM Interface
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x16/x32 data bus
1.8/ 2.5V interface voltage
Density support: up to 2Gb
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Mobile SDRAM Interface
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−
−
−
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Only x32 data bus with 133Mbps/pin data rate
133MHz address and command bus speed
1.8/ 2.5V interface voltage
Density support: up to 2Gb
Mobile SDRAM feature support:
∗
∗
∗
DS (Driver Strength Control)
TCSR (Temperature Compensated Self-Refresh Control)
PASR (Partial Array Self-Refresh Control)
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Mobile DDR Interface
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−
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x16 or x32 data bus with 266Mbs/pin double data rate (DDR)
1.8/ 2.5V interface voltage
Density support: up to 2Gb
1.1.4 MULTIMEDIA ACCELERATION
The S3C6410 microprocessor provides the following Multimedia Acceleration features:
1.1.4.1 Camera Interface
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ITU-R 601/ITU-R 656 format input support. 8-bit input is supported
Both progressive and interlaced input are supported
Camera input resolution up to 4096x4096 in YCbCr 4:2:2 format.
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4096x4096 input resolution assumes the hardware down-scaling units will be bypass
Up to 2048x2048 input resolution can optionally be input to the hardware down-scaling unit
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Resolution down-scaling hardware support for input resolutions up to 2048x2048
Codec/Preview output image generation (RGB 16/18/24-bit format and YCbCr 4:2:0/4:2:2 format)
Image windowing and digital zoom-in function
Test pattern generation
Image mirror and rotation supports Y-mirror, X-mirror, 90’, 180’ and 270’ rotation
H/W Color Space Conversion
LCD controller direct path supported
Image effect supported.
Preliminary product information describe products that are in development,
for which full characterization data and associated errata are not yet available.
Specifications and information herein are subject to change without notice.
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SAMSUNG [ SAMSUNG ]
