Si8610/20/21/22
Table 10. Thermal Characteristics
Parameter
Symbol
Test Condition
WB SOIC-16 NB SOIC-8
Unit
IC Junction-to-Air Thermal
Resistance
100
140
ºC/W
JA
500
375
250
125
0
460
360
VDD1, VDD2 = 2.5 V
V
DD1, VDD2 = 3.3 V
220
VDD1, VDD2 = 5.5 V
0
50
100
150
200
Case Temperature (ºC)
Figure 2. (WB SOIC-16) Thermal Derating Curve, Dependence of Safety Limiting Values
with Case Temperature per DIN EN 60747-5-2
400
320
VDD1, VDD2 = 2.5 V
300
270
V
DD1, VDD2 = 3.3 V
200
100
0
160
VDD1, VDD2 = 5.5 V
0
50
100
150
200
Case Temperature (ºC)
Figure 3. (NB SOIC-8) Thermal Derating Curve, Dependence of Safety Limiting Values
with Case Temperature per DIN EN 60747-5-2
16
Rev. 1.3
SILICON [ SILICON ]
