STK14EC16
ABSOLUTE MAXIMUM RATINGS
a
Voltage on Input Relative to Ground . . . . . . . . . . . . . –0.5V to 4.1V
Voltage on Input Relative to V
SS
. . . . . . . . . .–0.5V to (V
CC
+ 0.5V)
Voltage on DQ
0-7
or HSB . . . . . . . . . . . . . . . .–0.5V to (V
CC
+ 0.5V)
Temperature under Bias. . . . . . . . . . . . . . . . . . . . . .–55°C to 125°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .–55°C to 140°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .–65°C to 150°C
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1W
DC Output Current (1 output at a time, 1s duration) . . . . . . . 15mA
Preliminary
Note a: Stresses greater than those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. This is a
stress rating only, and functional operation of the device at con-
ditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rat-
ing conditions for extended periods may affect reliability.
TF (TSOP-II 44) PACKAGE THERMAL CHARACTERISTICS
θ
jc
tbd;
θ
ja
tbd [0fpm], tbd [200fpm], tbd C/W [500fpm].
UF (TSOP-II 54) PACKAGE THERMAL CHARACTERISTICS
θ
jc
tbd;
θ
ja
tbd [0fpm], tbd [200fpm], tbd C/W [500fpm].
BF (FBGA48) PACKAGE THERMAL CHARACTERISTICS
θ
jc
tbd C/W;
θ
ja
tbd [0fpm], tbd [200fpm], tbd C/W [500fpm].
DC CHARACTERISTICS
COMMERCIAL
SYMBOL
I
CC1
PARAMETER
MIN
Average V
CC
Current
70
65
50
75
70
52
mA
mA
mA
MAX
MIN
MAX
INDUSTRIAL
UNITS
(V
CC
= 2.7V-3.6V)
NOTES
t
AVAV
= 15ns
t
AVAV
= 25ns
t
AVAV
= 45ns
Dependent on output loading and cycle
rate. Values obtained without output
loads.
All Inputs Don’t Care, V
CC
= max
Average current for duration of STORE
cycle (t
STORE
)
W
≥
(V
CC
– 0.2V)
All Other Inputs Cycling at CMOS Levels
Dependent on output loading and cycle
rate. Values obtained without output
loads.
All Inputs Don’t Care
Average current for duration of STORE
cycle (t
STORE
)
E
≥ (V
CC
-0.2V)
All Others V
IN
≤
0.2V or
≥
(V
CC
-0.2V)
Standby current level after nonvolatile
cycle complete
V
CC
= max
V
IN
= V
SS
to V
CC
V
CC
= max
V
IN
= V
SS
to V
CC
, E or G
≥
V
IH
All Inputs
All Inputs
I
OUT
= – 2mA (except HSB)
I
OUT
= 4mA
I
CC2
Average V
CC
Current during
STORE
6
6
mA
I
CC3
Average V
CC
Current at t
AVAV
= 200ns
3V, 25°C, Typical
26
26
mA
I
CC4
Average V
CAP
Current during Auto Store
Cycle
V
CC
Standby Current
(Standby, Stable CMOS Levels)
6
6
mA
I
SB
3
3
mA
I
ILK
I
OLK
V
IH
V
IL
V
OH
V
OL
T
A
V
CC
V
CAP
NV
C
DATA
R
Input Leakage Current
Off-State Output Leakage Current
Input Logic “1” Voltage
Input Logic “0” Voltage
Output Logic “1” Voltage
Output Logic “0” Voltage
Operating Temperature
Operating Voltage
Storage Capacitance
Nonvolatile STORE operations
Data Retention
0
2.7
61
200
20
2.0
V
SS
–0.5
2.4
±1
±1
V
CC
+ 0.5
0.8
2.0
V
SS
–0.5
2.4
0.4
70
3.6
134
– 40
2.7
61
200
20
±1
±1
V
CC
+ 0.5
0.8
μA
μA
V
V
V
0.4
85
3.6
180
V
°C
V
μF
K
Years
3.3V nominal
Between V
CAP
pin and V
SS
, 5V rated
(Nom. 68
μF
to 150
μF
+20%, - 10%)
@ 55 deg C
Note: The HSB pin has I
OUT
=-10 uA for V
OH
of 2.4 V. This parameter is characterized but not tested.
Document Control #ML0061 Rev 1.1
Jan, 2008
4
Simtek Confidential
SIMTEK [ SIMTEK CORPORATION ]
