1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
TABLE 4: S
OFTWARE
C
OMMAND
S
EQUENCE
Command
Sequence
Byte-Program
Sector-Erase
Chip-Erase
Software ID
Entry
4,5
Software ID Exit
6
Software ID Exit
1st Bus
Write Cycle
Addr
1
5555H
5555H
5555H
5555H
XXH
5555H
Data
AAH
AAH
AAH
AAH
F0H
AAH
2AAAH
55H
5555H
F0H
T4.2 1147
2nd Bus
Write Cycle
Addr
1
2AAAH
2AAAH
2AAAH
2AAAH
Data
55H
55H
55H
55H
3rd Bus
Write Cycle
Addr
1
5555H
5555H
5555H
5555H
Data
A0H
80H
80H
90H
4th Bus
Write Cycle
Addr
1
BA
2
5555H
5555H
Data
Data
AAH
AAH
5th Bus
Write Cycle
Addr
1
2AAAH
2AAAH
Data
55H
55H
6th Bus
Write Cycle
Addr
1
SA
X3
5555H
Data
30H
10H
1. Address format A
14
-A
0
(Hex), Addresses A
MS
-A
15
can be V
IL
or V
IH
, but no other value, for the Command sequence.
A
MS
= Most significant address
A
MS
= A
16
for SST39SF010A, A
17
for SST39SF020A, and A
18
for SST39SF040
2. BA = Program Byte address
3. SA
X
for Sector-Erase; uses A
MS
-A
12
address lines
4. The device does not remain in Software Product ID mode if powered down.
5. With A
MS
-A
1
= 0; SST Manufacturer’s ID = BFH, is read with A
0
= 0,
SST39SF010A Device ID = B5H, is read with A
0
= 1
SST39SF020A Device ID = B6H, is read with A
0
= 1
SST39SF040 Device ID = B7H, is read with A
0
= 1
6. Both Software ID Exit operations are equivalent
Absolute Maximum Stress Ratings
(Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to V
DD
+0.5V
Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2.0V to V
DD
+2.0V
Voltage on A
9
Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 13.2V
Package Power Dissipation Capability (Ta = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W
Through Hold Lead Soldering Temperature (10 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
Surface Mount Lead Soldering Temperature (3 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C
Output Short Circuit Current
1
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
1. Outputs shorted for no more than one second. No more than one output shorted at a time.
O
PERATING
R
ANGE
Range
Commercial
Industrial
Ambient Temp
0°C to +70°C
-40°C to +85°C
V
DD
4.5-5.5V
4.5-5.5V
AC C
ONDITIONS OF
T
EST
Input Rise/Fall Time . . . . . . . . . . . . . . 5 ns
Output Load . . . . . . . . . . . . . . . . . . . . . C
L
=
See Figures 13 and 14
30 pF for 45 ns
Output Load . . . . . . . . . . . . . . . . . . . . . C
L
= 100 pF for 70 ns
©2003 Silicon Storage Technology, Inc.
S71147-06-000
8/04
7
SST [ SILICON STORAGE TECHNOLOGY, INC ]
