Package Information
STPS340
Figure 19. Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
board FR4, e
CU
= 35 µm) (SMB flat)
R
th(j-a)
(°C/W)
110
100
90
80
70
60
50
40
30
20
10
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
SMB flat
S
CU
(cm²)
2
Package Information
●
●
Band indicates cathode on SMB and SMC
Epoxy meets UL94, V0
DPAK dimensions
Dimensions
Ref
Millimeters
Min.
A
E
B2
C2
L2
A
Table 4.
Inches
Min.
0.086
0.035
0.001
0.025
0.204
0.017
0.018
0.236
0.251
0.173
0.368
Max.
0.094
0.043
0.009
0.035
0.212
0.023
0.023
0.244
0.259
0.181
0.397
Max.
2.40
1.10
0.23
0.90
5.40
0.60
0.60
6.20
6.60
4.60
10.10
2.20
0.90
0.03
0.64
5.20
0.45
0.48
6.00
6.40
4.40
9.35
A1
A2
B
D
B2
C
C2
H
L4
B
G
A1
R
R
C
D
E
A2
0.60 MIN.
G
H
V2
L2
L4
V2
0.80 typ.
0.60
0°
1.00
8°
0.031 typ.
0.023
0°
0.039
8°
6/11
STMICROELECTRONICS [ STMICROELECTRONICS ]
