MULTILAYER CERAMIC CHIP CAPACITOR - SMD
Suntan
®
TS18
8. Adhesion
Dielectrics
Specification
Testing Condition
The pressurizing force shall be 10N
(=1000g*f) and the duration of application
shall be 10±1sec.
NPO
X7R/X5R
Y5V
No removal of the terminations or
other defect shall occur.
hooked
jig
boar d
r= 5
0.
hi p
cr oss- sect i on
9. Solderability of Termination
Dielectrics
NPO
X7R/X5R
Y5V
10. Resistance to leaching
Dielectrics
NPO
X7R/X5R
Y5V
Specification
95% min. coverage of both terminal
electrodes and less than 5% have pin
holes or rough spots.
No remarkable visual damage.
Testing Condition
Solder temperature: 270±5℃
Dipping time: 10±1 seconds.
Completely soak both terminal electrodes in
solder
Specification
95% min. coverage of both terminal
electrodes and less than 5% have pin
holes or rough spots.
Testing Condition
Solder temperature: 230±5℃
Dipping time: 2±1 seconds.
Completely soak both terminal electrodes in
solder
Suntan
®
Technology Company Limited
Website: www.suntan.com.hk
Email: info@suntan.com.hk
Tel: (852) 8202 8782
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