Qualpack TSS463 / TSS461C
4.1 Change Procedure
All changes are controlled by ECN (Engineering Change Notice). All major changes are notified to those
customers using products which are affected by the change.
A major change is defined as a change which affects the electrical and/or mechanical specification as
defined in the datasheet or which affects the following parameters as defined hereafter:
1
1-1
1-2
1-3
1-4
1-5
1-6
1-7
2
2-1
2-2
2-3
2-4
2-5
3
3-1
3-2
3-3
3-4
3-5
4
4-1
4-2
4-3
4-4
General Major Changes
Manufacturing line
Sequence of fabrication process cycle
Material
Electrical parameter
Dimension
Pad location
Die size
Changes specific to wafer fabrication area
Doping process
Gate oxide formation method
Equipement change
Layer thickness
Module dimensions
Changes specific to to assembly process area
Sawing process
Die attach process
Wire interconnect method
Molding process
Tinning process
Changes specific to test area
Specification limit
Test coverage reduction
Product identification
Final conditioning
Rev. 2 – January 1999
11
TEMIC [ TEMIC SEMICONDUCTORS ]
