TS80C31X2 参数 Datasheet PDF下载

Qualpack TSS463 / TSS461C

3.6 Wafer Process Control

All the inspections and controls are defined as a process step in the production management software,

and are led by using a centralized SPC software. PC system could be summarized as follows:

Engineering Database

-

NANTES

:

hermetic packages

-

Subcontractors

:

plastic packages

-

NANTES

:

hermetic packages

-

S ubcontractors

:

plastic packages

Physical

Critical process parameters are identified by using F.M.E.A. and other advanced tools.

Those parameters are followed in real time with the SPC methodology and their capability is measured

and monthly reported in the Operation Review.

For end 1997, the Cpk target is the following :

all parameters with Cpk above 1.67

% of all Parameters per Cpk categories

100%

80%

60%

40%

20%

0%

1995

1996

Q1-

Q2

97

Q3-

Q4

97

Obj.

98

>2

<2

<1.67

Rev. 2 – January 1999

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