Qualpack TS80C31X2/C32X2
4. Qualification
Product
Qualification
Wafer Process
Qualification
Package
Qualification
Device Type
(Design)
Qualification
All product qualifications are split into three distinct steps as shown above. This same procedure is also
used to qualify a change. Before a product is released for use, it must have been manufactured using a
qualified wafer and package process. Before a device is released for production processing, it must also
have successfully completed its required specific qualification.
The standard tests which are used for this procedure are shown in the section
"Qualification Flow"
10
Rev. 2 – January 1999
TEMIC [ TEMIC SEMICONDUCTORS ]
