Qualpack TS80C31X2/C32X2
3.3 Package Technology
3.3.1 SOIC.300 16 leads
Package weight
Chip separation method
Lead frame
Material
Thickness
Size
Lead plating
Die attach
Material
Type
Wire bonding
Material
Diameter
Method
Molding
Material
Flammability rating
Marking
Method
Coding example
0,43 g
Sawing
Cu
10 mils
270*270 mils2
Electroplated Sn/Pb 85/15
Silver epoxy
Ablestick 84-1 LMISR4
Gold
33um
Thermosonic
Nitto MP8000AN
UL94V-0
Printed ink
TEMIC
optional special customer marking
TSS463
YY MM
No
Tube
Antistatic PVC
47
Box
Cardboard
1692
Device type, Quantity, Date Code, Prod. code
Code 39 to EIA-556-A
Dry packing
Tube packed
Primary
Material
Number per unit
Secondary
Material
Number per unit
Labelling (minimum)
Bar coding
6
Rev. 2 – January 1999
TEMIC [ TEMIC SEMICONDUCTORS ]
