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TSC87251G2D 参数 Datasheet PDF下载

TSC87251G2D图片预览
型号: TSC87251G2D
PDF下载: 下载PDF文件 查看货源
内容描述: 0.5庵SCMOS3技术 [0.5 Um SCMOS3 Technology]
分类和应用:
文件页数/大小: 28 页 / 154 K
品牌: TEMIC [ TEMIC SEMICONDUCTORS ]
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Qualpack TSC87251G2D
Method
Molding
Material
Flammability rating
Marking
Method
Coding example
Thermosonic
Sumitomo EME 6300HS
UL94V-0
Printed ink
T
optional special customer marking
TSC83C51RB2-MCA
© INTEL 80,82
Date-code Lot nbr
No
Tube
Antistatic PVC
27
Box
Cardboard
972
Device type, Quantity, Date Code, Production code
Code 39 to EIA-556-A
Dry packing
Tube packed
Primary
Material
Number per unit
Secondary
Material
Number per unit
Labeling (minimum)
Bar coding
2.3.2 Other available packages
PQFP, PDIP, CQFP, CERDIP
TQFP, VQFP
No dry pack required
Dry pack required
2.4 Test
Probe equipment
Probe temperature
Test equipment
Test temperature
Commercial range
Industrial range
Automotive range
SCHLUMBERGER ITS9000 / S15
85°C
SENTRY 15
25°C
25°C and optional 85°C
25°C, 125°c and optional -40°c
Rev. 0 – October 1999
7