Qualpack TSC87251G2D
2.6 Wafer Process Control
All the inspections and controls are defined as a process step in the production management software,
and are led by using a centralized SPC software. PC system could be summarized as follows:
Engineering Database
Wafer Fab
Probe
die-sort
Assembly
Final Test
-
NANTES:
hermetic packages
-
Subcontractors
:
plastic packages
Process
parameters
Electrical
Test
-
NANTES
:
hermetic packages
-
Subcontractors
:
plastic packages
Physical
SPC (xbar / R)
Cpk tracking
Electrical
SPC (xbar / s)
Cpk tracking
Attribute
Physical measurement
SPC (xbar / R)
Cpk tracking
Attribute
Measurement
Critical process parameters are identified by using F.M.E.A. and other advanced tools.
Those parameters are followed in real time with the SPC methodology and their capability is measured
and monthly reported in the Operation Review.
For end 1999, the Cpk target is the following:
% of all parameters per Cpk categories
100%
80%
60%
40%
20%
0%
1995
1996
1997
1998
Obj. 99
>1.67
<1.67
Rev. 0 – October 1999
9
TEMIC [ TEMIC SEMICONDUCTORS ]
