WED3C755E8M350BI 参数 Datasheet PDF下载

White Electronic Designs

FIG. 5 - PIN ASSIGNMENTS

WED3C755E8M-XBX

Ball assignments of the 255 CBGA package as viewed from the top surface.

1

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

T

2

3 4 5 6 7 8 9 10 11 12 13 14 15

16

Side profile of the CBGA package to indicate the direction of the top surface view.

View

Substrate Assembly

Underfill Encapsulant

Die

White Electronic Designs Corp. reserves the right to change products or specifications without notice.

May, 2003

Rev 2

4

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com