BSI
n
ORDERING INFORMATION
BH62UV8000
X
X
Z
YY
SPEED
70: 70ns
BH62UV8000
PKG MATERIAL
-: Normal
G: Green
GRADE
I: -25
o
C ~ +85
o
C
PACKAGE
A: BGA-48-0608
D: DICE
Note:
Brilliance Semiconductor Inc. (BSI) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not
authorize its products for use as critical components in any application in which the failure of the BSI product may be expected to result in
significant injury or death, including life-support systems and critical medical instruments.
n
PACKAGE DIMENSIONS
NOTES:
1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS.
2: PIN#1 DOT MARKING BY LASER OR PAD PRINT.
3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS.
1.4 Max.
BALL PITCH e = 0.75
D
8.0
E
6.0
N
48
D1
5.25
E1
3.75
D1
e
VIEW A
48 mini-BGA (6 x 8)
R0201-BH62UV8000
E1
8
Revision 1.0
Jul.
2005