CY62128B
MoBL
Package Diagrams
32-Lead (450 MIL) Molded SOIC S34
16
1
0.546[13.868]
0.566[14.376]
0.440[11.176]
0.450[11.430]
17
32
0.793[20.142]
0.817[20.751]
0.006[0.152]
0.012[0.304]
0.118[2.997]
MAX.
0.004[0.102]
0.047[1.193]
0.063[1.600]
0.101[2.565]
0.111[2.819]
0.050[1.270]
BSC.
0.004[0.102]
MIN.
0.014[0.355]
0.020[0.508]
0.023[0.584]
0.039[0.990]
SEATING PLANE
51-85081-*B
32-Lead Thin Small Outline Package Type I (8x20 mm) Z32
51-85056-*D
Document #: 38-05300 Rev. *C
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