Thermal
19.5.2
Minimum Platform Frequency Requirements for High-Speed
Interfaces
Section 4.4.3.6 “I/O Port Selection” of the
MPC8572E PowerQUICC™ III Integrated Host Processor
Family Reference Manual,
describes various high-speed interface configuration options. Note that the
CCB clock frequency must be considered for proper operation of such interfaces as described below.
For proper PCI Express operation, the CCB clock frequency must be greater than or equal to:
527 MHz
× (
PCI Express link width
)
----------------------------------------------------------------------------------------------
8
See Section 21.1.3.2, “Link Width” of the
MPC8572E PowerQUICC™ III Integrated Host Processor
Family Reference Manual,
for PCI Express interface width details. Note that the “PCI Express link width”
in the above equation refers to the negotiated link width as the result of PCI Express link training, which
may or may not be the same as the link width POR selection.
For proper serial RapidIO operation, the CCB clock frequency must be greater than:
2
× (
0.80
) × (
serial RapidIO interface frequency
) × (
serial RapidIO link width
)
-----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
64
See Section 20.4, “1x/4x LP-Serial Signal Descriptions” of the
MPC8572E PowerQUICC™ III Integrated
Host Processor Family Reference Manual,
for serial RapidIO interface width and frequency details.
20 Thermal
This section describes the preliminary thermal specifications of the MPC8572E. This is subject to change.
Table 83
shows the thermal characteristics for the package, 1023 33x33 FC-PBGA.
force is 10 pounds force (45 Newton).
Table 83. Package Thermal Characteristics
Rating
Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to ambient (at 200 ft./min.)
Junction to ambient (ar 200 ft./min.)
Junction to board
Board
Single-layer (1s)
Four-layer (2s2p)
Single-layer (1s)
Four-layer (2s2p)
—
Symbol
R
ΘJA
R
ΘJA
R
ΘJMA
R
ΘJMA
R
ΘJB
Value
15
11
11
8
4
Unit
Notes
1, 2
1, 3
1, 3
1, 3
4
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 4
122
Freescale Semiconductor
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
