1MBI50U4F-120L-50
Electrical characteristics (at Tj= 25°C unless otherwise specified)
Items
Zero gate voltage collector current
Gate-Emitter leakage current
Gate-Emitter threshold voltage
Collector-Emitter saturation voltage
Input capacitance
Turn-on time
Turn-off time
Symbols
I
CES
I
GES
V
GE (th)
V
CE (sat)
(terminal)
V
CE (sat)
(chip)
Cies
ton
tr
tr(i)
toff
tf
V
F
(terminal)
V
F
(chip)
IR
V
F
(terminal)
V
F
(chip)
trr
R lead
Conditions
V
GE
= 0V, V
CE
= 1200V
V
CE
= 0V, V
GE
= ±20V
V
CE
= 20V, I
C
= 50mA
http://www.fujielectric.com/products/semiconductor/
IGBT Modules
Tj=25°C
Tj=125°C
V
GE
= 15V
I
C
= 50A
Tj=25°C
Tj=125°C
V
GE
= 0V, V
CE
= 10V, f = 1MHz
V
CC
= 600V, I
C
= 50A
V
GE
= ±15V, R
G
= 22Ω
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Forward on voltage
Reverse Current
Forward on voltage
Reverse recovery time
Lead resistance, terminal-chip(*4)
Note *4: Biggest internal terminal resistance among arm.
V
GE
= 0V
I
F
= 25A
V
CE
= 1200V
V
GE
= 0V
I
F
= 75A
I
F
= 75A
Characteristics
min.
typ.
max.
-
-
1.0
-
-
200
4.5
6.5
8.5
-
2.00
2.15
-
2.20
-
-
1.90
2.05
-
2.10
-
-
6
-
-
0.32
1.20
-
0.10
0.60
-
0.03
-
-
0.41
1.00
-
0.07
0.30
-
1.65
2.00
-
1.75
-
-
1.60
1.85
-
1.70
-
-
-
1.0
-
1.75
1.90
-
1.90
-
-
1.60
1.75
-
1.75
-
-
-
0.35
-
1.39
-
Units
mA
nA
V
V
nF
µs
V
mA
V
µs
mΩ
Thermal resistance characteristics
Items
Thermal resistance (1device)
Contact thermal resistance
Symbols
Rth(j-c)
Rth(c-f)
Conditions
IGBT
Inverse Diode
FWD
with Thermal Compound (*5)
Characteristics
min.
typ.
max.
-
-
0.45
-
-
1.19
-
-
0.48
-
0.05
-
Units
°C/W
Note *5: This is the value which is defined mounting on the additional cooling fin with thermal compound.
2