iC-MA
ANGULAR HALL SENSOR / ENCODER
Rev B3, Page 3/18
PACKAGES DFN10 according to the JEDEC standard
PIN CONFIGURATION -
DFN10 4 mm x 4 mm
PIN FUNCTIONS
No. Name Function
1
2
3
4
5
6
7
8
9
10
NEN
GND
CFG2
B
A
D
C
CFG3
VDD
CFG1
Enable Input, low active
Ground
Configuration Input 2
Bidirectional Input/Output B
Bidirectional Input/Output A
Bidirectional Input/Output D
Bidirectional Input/Output C
Configuration Input 3
+5 V Supply Voltage
Configuration Input 1
1
2
3
10
9
4
5
iC-MA
...
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8
7
6
The
Thermal Pad
on the bottom of the package should be connected to Ground (GND) on the PCB.
Orientation of package label ( MA CODE ...) may vary.
PIN CONFIGURATION -
Die
2.74 mm x 1.94 mm
PIN FUNCTIONS
No. Name Function
1
2
3
4
5
6
7
8
9
10
NEN
GND
CFG2
B
A
D
C
CFG3
VDD
CFG1
Enable Input, low active
Ground
Configuration Input 2
Bidirectional Input/Output B
Bidirectional Input/Output A
Bidirectional Input/Output D
Bidirectional Input/Output C
Configuration Input 3
+5 V Supply Voltage
Configuration Input 1
9
10
8
7
6
1
5
2
3
4
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