iC-MA
ANGULAR HALL SENSOR / ENCODER
Rev B3, Page 4/18
ABSOLUTE MAXIMUM RATINGS
Beyond these values damage may occur; device operation is not guaranteed.
Item
No.
Symbol
Parameter
Supply voltage
Voltages at A, B, C, D, NEN, CFG1,
CFG2
Current at VDD
Current at A, B, C, D, NEN, CFG1,
CFG2
Pulse current (Latch-up immunity)
ESD-Voltage at all pins
Storage temperature
Pulse width < 10 µs
HBM 100 pF discharged over 1.5 kΩ
-40
V() < VDD + 0.3 V
Conditions
Min.
-0.3
-0.3
-30
-30
-10
-100
Max.
6
6
30
30
10
100
2
150
V
V
mA
mA
mA
mA
kV
°C
Unit
G001 VDD
G002 V()
G003 Imx(VDD)
G005 Imx()
G006 Ilu()
G007 Vd()
G008 Ts
G004 Imx(GND) Current at GND
THERMAL DATA
Operating conditions: VDD = 5 V ±10 %
Item
No.
T01
T02
Symbol
Ta
Rthja
Parameter
Ambient temperature
Thermal resistance chip/ambient
DFN10 on multi-layer test board acc. JEDEC
standard
Conditions
Min.
-40
Typ.
Max.
125
200
°C
K/W
Unit
All voltages are referenced to ground unless otherwise stated.
All currents into the device pins are positive; all currents out of the device pins are negative.
ICHAUS [ IC-HAUS GMBH ]
