Electrical Specifications
Table 2-8. Voltage and Current Specifications (Sheet 2 of 2)
Symbol
I
CC_VCCA
I
CC_VCCIOPLL
I
CC_GTLREF
NOTES:
1.
2.
Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These specifications will be up-
dated with characterized data from silicon measurements at a later date.
Each processor is programmed with a maximum valid voltage identification value (VID), which is set at manufacturing and can not be altered.
Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have different settings
within the VID range. Note this differs from the VID employed by the processor during a power management event (Thermal Monitor 2 or En-
hanced HALT State).
These voltages are targets only. A variable voltage source should exist on systems in the event that a different voltage is required. See
and
for more information.
The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE lands at the socket with a 100 MHz bandwidth os-
cilloscope, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of ground wire on the probe should be less
than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.
Refer to
and
for the minimum, typical, and maximum V
CC
allowed for a given current. The processor should not be sub-
jected to any Vcc and Icc combination wherein V
CC
exceeds V
cc_max
for a given current.
775_VR_CONFIG_04A and 775_VR_CONFIG_04B refer to voltage regulator configurations that are defined in the
Voltage Regulator Down
(VRD) 10.1 Design Guide For Desktop LGA775 Socket.
Refer to
and
for the minimum, typical, and maximum V
CC
allowed for a given current. The processor should not be subjected
to any V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_max
for a given current.
These frequencies will operate in a system designed for 775_VR_CONFIG_04B processors. The power and I
CC
will be incrementally higher in
this configuration due to the improved loadline and resulting higher V
CC
.
I
cc_max
is specified at V
CC_max
.
The current specified is also for AutoHALT State.
Icc Stop-Grant and I
CC
Enhanced Auto Halt are specified at V
CC_max
.
The maximum instantaneous current the processor will draw while the thermal control circuit is active as indicated by the assertion of PROCHOT#
is the same as the maximum Icc for the processor.
V
TT
must be provided via a separate voltage source and not be connected to V
CC
. This specification is measured at the land.
Baseboard bandwidth is limited to 20 MHz.
These parameters are based on design characterization and are not tested.
This is maximum total current drawn from V
TT
plane by only the processor. This specification does not include the current coming from R
TT
(through the signal line). Refer to the
Voltage Regulator Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket
to determine the total I
TT
drawn by the system.
Parameter
I
CC FOR
PLL
LANDS
I
CC FOR
I/O PLL
LAND
I
CC
for GTLREF
Min
—
—
—
Typ
—
—
—
Max
120
100
200
Unit
mA
mA
µA
Notes
1
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
26
Datasheet
INTEL [ INTEL CORPORATION ]
