EL4585
Typical Performance Curves
I
DD
vs F
OSC
OSC GAIN @ 20MHz vs TEMP
TYPICAL VARACTOR
OSC GAIN vs F
OSC
CHARGE PUMP DUTY CYCLE vs
θ
E
Package Power Dissipation vs Ambient Temperature
JEDEC JESD51-3 Low Effective Thermal Conductivity
Test Board
1.8
1.6
POWER DISSIPATION (W)
POWER DISSIPATION (W)
1.4
1.23W
1.2
1 0.91W
0.8
0.6
0.4
0.2
0
0
25
50
75 85 100
125
150
AMBIENT TEMPERATURE (°C)
SO16 (0.150”)
θ
JA
=110°C/W
PDIP16
θ
JA
=81°C/W
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
Package Power Dissipation vs Ambient Temperature
JEDEC JESD51-7 High Effective Thermal Conductivity
Test Board
1.43W
1.25W
PDIP16
θ
JA
=70°C/W
SO16 (0.150”)
θ
JA
=80°C/W
0
25
50
75
100
125
150
AMBIENT TEMPERATURE (°C)
6
FN7175.3
July 1, 2005
INTERSIL [ INTERSIL CORPORATION ]
