Si500D
Package Specifications
Table 1. Package Diagram Dimensions (mm)
Dimension
A
A1
b
D
e
E
L
Min
0.80
0.00
0.59
3.20 BSC.
1.27 BSC.
4.00 BSC.
0.95
1.00
1.05
Nom
0.85
0.03
0.64
Max
0.90
0.05
0.69
Dimension
L1
aaa
bbb
ccc
ddd
eee
Min
0.00
—
—
—
—
—
Nom
0.05
—
—
—
—
—
Max
0.10
0.10
0.10
0.08
0.10
0.05
Table 2. Pad Connections
1
2
3
4
5
6
OE
NC—Make no external
connection to this pin
GND
Output
Complementary Output
VDD
Table 3. Tri-State/Powerdown/Driver Stopped
Function on OE (3rd Option Code)
A
B
C
D
Active
Power-
down
E
Active
Active
F
Active
Driver
Stopped
Active
Open
Active Active Active
1
Tri-
Active
State
Level
Active
0
Tri-
Power-
Driver
Active
Active
down
Stopped
Level
State
Dimension
C1
E
X1
Y1
(mm)
2.70
1.27
0.75
1.55
0 C CC CC
T TTT TT
Y Y WW
0 = Si500
CCCCC = mark code
TTTTTT = assembly manufacturing code
YY = year
WW = work week
Figure 1. Recommended Land Pattern
Figure 2. Top Mark
Rev. 1.0
3
SILABS [ SILICON LABORATORIES ]
